6.0W/mK Thermal Conductive Pad Offering Superior Thermal Conductivity And Mechanical Stability For Electronic Cooling Solutions
Price:
Negotiation
MOQ:
1000pcs
Delivery Time:
3-5work days
Brand:
ZIITEK
Product Description
6.0W/mK Thermal Conductive Pad Offering superior thermal conductivity and mechanical stability for electronic cooling solutions
Product Overview
TIF®100 6050-19 Series is a well-balanced, general-purpose thermal pad that offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.
Key Features
- High thermal conductivity
- Super soft and highly compliant
- Self-adhesive without the need for additional surface adhesives
- Good insulation performance
Applications
- Mainboard/mother board
- Memory Modules
- Mass storage devices
- Audio and video components
- Network communication products
- Electric vehicle batteries
- Computer CPU/GPU Cooling
- New energy vehicle power systems
- AI server
- Medical equipment
- Unmanned aerial vehicle (UAV)
- Robot
- Wireless Charger
Technical Specifications of TIF®100 6050-19 Series
| Property | Value | Test Method |
|---|---|---|
| Color | Yellow | Visual |
| Construction | Ceramic filled silicone elastomer | - |
| Density (g/cm³) | 3.4 | ASTM D792 |
| Thickness Range (inch/mm) | 0.040~0.200 / 1.00~5.00 | ASTM D374 |
| Hardness (Shore 00) | 50 | ASTM 2240 |
| Recommended Operating Temperature (℃) | -40 ~ 200 | - |
| Breakdown Strength (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @1Mhz | 6.0 | ASTM D150 |
| Volume Resistivity (Ohm-cm) | ＞1.0×10¹² | ASTM D257 |
| Thermal Conductivity (W/m-K) | 6.0 | ASTM D5470 / ISO22007 |
| Fire rating | V-0 | UL 94 (E331100) |
Product Specifications
Standard Thickness: 0.040" (1.00mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
Component Codes
- Reinforcement Fabric: FG (Fiberglass)
- Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
- Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging & Lead Time
Packaging Details:
- With PET film or foam for protection
- Paper card to separate each layer
- Export carton inside and outside
- Customized packaging to meet customer requirements
Lead Time:
Quantity: 5000 pieces
Estimated Time: To be negotiated
Company Profile
Ziitek, founded in 2006 and headquartered in Dongguan, Guangdong Province, is the world's leading manufacturer of thermal interface materials and thermal management solutions. After years of technical development, the company has built a complete product matrix including thermal interface materials, EMI shielding materials, heating products, foamed silica gel sealing rings, and heat conduction engineering plastics. With production bases in Kunshan, Taiwan Province and Vietnam, we provide one-stop thermal management solutions for customers worldwide.
Frequently Asked Questions
Q: How Do I Choose the Right Thermal Interface Material?
A: Start with heat source power, gap thickness, target thermal resistance, operating temperature, contact area, assembly pressure, electrical insulation, flame resistance and reliability requirements.
Q: What Thermal Interface Materials Does ZIITEK Offer?
A: ZIITEK focuses on thermal management materials and solutions for electronics. Its portfolio includes thermal pads, thermal gels and other thermal management materials, with solutions matched to gap, thermal performance, thickness, hardness, electrical insulation and reliability requirements.
Q: What is Thermal Conductivity?
A: Thermal conductivity indicates a material's ability to conduct heat and is typically measured in W/m*K. Under the same testing conditions, a higher thermal conductivity generally indicates better heat-conduction capability.
Q: What is Thermal Resistance?
A: Thermal resistance indicates the resistance to heat flow through a material or interface and is typically expressed in K/W or °C/W. Lower thermal resistance generally means that heat can pass through the material more efficiently.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Co., Ltd
Location
No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai