TIC812G Phase Change Thermal Interface Material 0.012" Thickness 5.0 W/mK Conductivity for Notebook PCs
Price:
negotiation
MOQ:
1000PCS
Delivery Time:
3-5 work days
Brand:
Ziitek
Product Description
TIC™812G Phase Change Thermal Interface Material
TIC™812G series is a low melting point thermal interface material designed for high-performance thermal management applications. At 50°C, the material begins to soften and flow, effectively filling microscopic irregularities between thermal solutions and integrated circuit package surfaces to minimize thermal resistance.
Product Overview
TIC™812G remains a flexible solid at room temperature and is freestanding without reinforcing components that could compromise thermal performance. The material demonstrates exceptional stability with no thermal performance degradation after 1,000 hours at 130°C or 500 thermal cycles from -25°C to 125°C.
Technical Documentation
Primary Applications
- High Frequency Microprocessors
- Notebook and Desktop PCs
- Computer Servers
- Memory Modules
- Cache Chips
- IGBTs
Key Features
- Ultra-low thermal resistance: 0.014℃-in²/W
- Naturally tacky at room temperature - no adhesive required
- No heat sink preheating required
Technical Specifications
| Property | TIC™805G | TIC™808G | TIC™810G | TIC™812G | Test Method |
|---|---|---|---|---|---|
| Color | Gray | Gray | Gray | Gray | Visual |
| Thickness | 0.005" (0.126mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | 0.012" (0.305mm) | |
| Thickness Tolerance | ±0.0008" (±0.019mm) | ±0.0008" (±0.019mm) | ±0.0012" (±0.030mm) | ±0.0012" (±0.030mm) | |
| Thermal Impedance @ 50 psi | 0.014℃-in²/W (0.09℃-cm²/W) | 0.020℃-in²/W (0.13℃-cm²/W) | 0.038℃-in²/W (0.25℃-cm²/W) | 0.058℃-in²/W (0.37℃-cm²/W) | ASTM D5470 (modified) |
Additional Properties: Density: 2.6g/cc | Temperature Range: -25℃～125℃ | Phase Change Softening Temperature: 50℃~60℃ | Thermal Conductivity: 5.0 W/mK
Standard Thickness Options
0.005" (0.127mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | 0.012" (0.305mm)
Consult factory for alternate thickness requirements.
Standard Sizes
10" x 16" (254mm x 406mm) | 16" x 400' (406mm x 121.92M)
TIC™800 series products are supplied with white release paper and bottom liner. Available in kiss cut with extended pull tab liner or individual die cut shapes.
Packaging & Lead Time
Packaging: PET film or foam protection, paper card separation between layers, export carton packaging, customized options available.
Lead Time: 5,000 pieces - estimated time to be negotiated.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronic Materials & Technology Ltd.
Location
No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai