TIC™800P Series Thermal Interface Pads 0.95 W/mK Conductivity 0.003-0.010" Thickness
The TIC™800P Series is a low melting point thermal interface material designed for high-frequency microprocessors. At 50°C, the material softens and flows to fill microscopic surface irregularities, effectively reducing thermal resistance between components.
- 0.024℃-in²/W thermal resistance at 50 psi
- 0.95 W/mK thermal conductivity
- Naturally tacky at room temperature - no adhesive required
- No heat sink preheating required
- Flexible solid at room temperature without reinforcing components
- Operating temperature range: -25°C to 125°C
The TIC™800P Series demonstrates exceptional stability with no thermal performance degradation after 1,000 hours at 130°C or after 500 thermal cycles from -25°C to 125°C. The material softens without fully changing state, resulting in minimal migration at operating temperatures.
| Property | TIC™803P | TIC™805P | TIC™808P | TIC™810P | Testing Standards |
|---|---|---|---|---|---|
| Color | Pink | Pink | Pink | Pink | Visual |
| Composite Thickness | 0.003" (0.076mm) | 0.005" (0.127mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | |
| Thickness Tolerance | ±0.0006" (±0.016mm) | ±0.0008" (±0.019mm) | ±0.0008" (±0.019mm) | ±0.0012" (±0.030mm) | |
| Thermal Impedance @ 50 psi | 0.021℃-in²/W (0.14℃-cm²/W) | 0.024℃-in²/W (0.15℃-cm²/W) | 0.053℃-in²/W (0.34℃-cm²/W) | 0.080℃-in²/W (0.52℃-cm²/W) | ASTM D5470 (modified) |
- High Frequency Microprocessors
- Notebook and Desktop PCs
- Computer Servers
- Memory Modules
- Cache Chips
- IGBTs
0.003" (0.076mm), 0.005" (0.127mm), 0.008" (0.203mm), 0.010" (0.254mm)
Consult the factory for alternate thickness options.
9" x 18" (228mm x 457mm), 9" x 400' (228mm x 121M)
TIC™800 series products are supplied with white release paper and bottom liner. Available in kiss cut with extended pull tab liner or individual die cut shapes.
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