TIA800FG Series Thermal Adhesive Tape 1.0 W/mK with 0.005-0.020" Thickness for LED Heat Dissipation
Price:
Negotiable
MOQ:
10SQM
Delivery Time:
2-3Work day
Brand:
Ziitek
Product Description
TIA™800FG Series Thermal Adhesive Tape
Product Overview
The TIA™800FG Series thermal adhesive tape is engineered for bonding heat dissipation components in electronic applications. This double-sided pressure-sensitive adhesive tape delivers exceptional bonding strength with low thermal impedance, making it an effective replacement for thermal grease and mechanical fastening methods.
Key Features
- Thermal conductivity: 1.0 W/mK
- High bond strength across various surfaces
- Advanced thermally conductive acrylic adhesive
- Glass fiber reinforced backing for durability
- Voltage breakdown ratings from 2000-3500 Vac
Technical Specifications
| Product Name | Composite Thickness | Thermal Impedance @50psi | Voltage Breakdown |
|---|---|---|---|
| TIA™805FG | 0.005" (0.127mm) | 0.52 ℃-in²/W | > 2000 Vac |
| TIA™806FG | 0.006" (0.152mm) | 0.59 ℃-in²/W | > 2000 Vac |
| TIA™808FG | 0.008" (0.203mm) | 0.83 ℃-in²/W | > 2300 Vac |
| TIA™810FG | 0.010" (0.254mm) | 0.91 ℃-in²/W | > 3000 Vac |
| TIA™815FG | 0.015" (0.381mm) | 1.15 ℃-in²/W | > 3500 Vac |
| TIA™820FG | 0.020" (0.508mm) | 1.43 ℃-in²/W | > 3500 Vac |
Applications
- Mounting heat sinks onto BGA graphic processors
- Attaching heat spreaders to power converter PCBs
- Motor control PCB thermal management
- Alternative to heat cure adhesives, screw mounting, or clip mounting
Available Options
Standard Thicknesses
0.005", 0.006", 0.008", 0.010", 0.015", 0.020"
Standard Sizes
10" x 18" (254mm x 457mm)
10" x 400' (254mm x 121.9M)
10" x 400' (254mm x 121.9M)
Documentation
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Co., Ltd
Location
No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai