TIA800FG Series Thermal Adhesive Tape 1.0 W/mK with 0.005-0.020" Thickness for LED Heat Dissipation
Price:
Negotiable
MOQ:
10SQM
Delivery Time:
2-3Work day
Brand:
Ziitek
Product Description
TIA™800FG Series Thermal Adhesive Tape
Product Overview
The TIA™800FG Series thermal adhesive tape is engineered for bonding heat dissipation components in electronic applications. This double-sided pressure-sensitive adhesive tape delivers exceptional bonding strength with low thermal impedance, making it an effective replacement for thermal grease and mechanical fastening methods.
Key Features
- Thermal conductivity: 1.0 W/mK
- High bond strength across various surfaces
- Advanced thermally conductive acrylic adhesive
- Glass fiber reinforced backing for durability
- Voltage breakdown ratings from 2000-3500 Vac
Technical Specifications
| Product Name | Composite Thickness | Thermal Impedance @50psi | Voltage Breakdown |
|---|---|---|---|
| TIA™805FG | 0.005" (0.127mm) | 0.52 ℃-in²/W | > 2000 Vac |
| TIA™806FG | 0.006" (0.152mm) | 0.59 ℃-in²/W | > 2000 Vac |
| TIA™808FG | 0.008" (0.203mm) | 0.83 ℃-in²/W | > 2300 Vac |
| TIA™810FG | 0.010" (0.254mm) | 0.91 ℃-in²/W | > 3000 Vac |
| TIA™815FG | 0.015" (0.381mm) | 1.15 ℃-in²/W | > 3500 Vac |
| TIA™820FG | 0.020" (0.508mm) | 1.43 ℃-in²/W | > 3500 Vac |
Applications
- Mounting heat sinks onto BGA graphic processors
- Attaching heat spreaders to power converter PCBs
- Motor control PCB thermal management
- Alternative to heat cure adhesives, screw mounting, or clip mounting
Available Options
Standard Thicknesses
0.005", 0.006", 0.008", 0.010", 0.015", 0.020"
Standard Sizes
10" x 18" (254mm x 457mm)
10" x 400' (254mm x 121.9M)
10" x 400' (254mm x 121.9M)
Documentation
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronic Materials & Technology Ltd.
Location
No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai