The TIS™100 Series represents high-efficiency thermal insulation materials with exceptional thermal conduction properties. By incorporating a silica gel insulation base film into the heat-conduction matrix, these materials deliver outstanding performance in both electrical insulation and thermal management applications.

• Soft texture with high thermal conductivity
• Excellent dielectric strength for electrical isolation
• Low thermal resistance with high voltage isolation capability
• Resistant to tears and punctures for enhanced durability

• Automotive battery systems and power supplies
• Power semiconductor devices
• Audio and video electronic components
• Motor controllers and drive systems

Consult factory for alternate thickness availability.

Standard Roll Size: 12" x 160' (304mm x 48.76M)

Individual die-cut shapes and custom thicknesses available upon request. All products include standard fiberglass reinforcement (designated by "FG" suffix).

Ziitek thermal conductive interface materials offer comprehensive solutions for various applications including mainboards, VGA cards, notebooks, DDR products, LCD/PDP displays, server power systems, and LED lighting applications.

• ISO9001:2015
• ISO14001:2004
• IATF16949:2016
• IECQ QC 080000:2017
• UL Certified