Dongguan Ziitek Electronical Material and Technology Co., Ltd
                                                                                                           
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Chemicals Adhesives & Sealants

TIE™ 280-12AB Black Two Component Epoxy Thermal Conductive Glue 1.2W/mK for LED Lighting -40℃ to +130℃

Price Negotiable
Price: Negotiable
MOQ: 2kg/LOT
Delivery Time: 2-3 work day
Brand: Ziitek
Product Description
TIE™ 280-12AB Two Component Epoxy Thermal Conductive Glue
Product Overview

Black two-component epoxy thermal conductive adhesive paste with 1.2W/mK thermal conductivity, designed for LED lighting applications. Features excellent waterproof properties and operates effectively from -40℃ to +130℃.

Key Features
  • High thermal conductivity: 1.2W/mK
  • Excellent electrical insulation and smooth surface finish
  • Low shrinkage during curing process
  • Low viscosity for efficient air release
  • Superior waterproof and solvent resistance
  • Extended operational lifetime
  • Excellent thermal shock efficiency and impact resistance
  • UL 94 V-0 fire resistance rating
Applications
  • Automotive starters potting and thermal detector potting
  • Ferrite adhesion and TIP type LED applications
  • Relay sealant with excellent adhesion to rubber, ceramics, PCB and plastics
  • Power transformers, coils, and capacitor potting
  • Small electrical device encapsulation
  • Metal, glass, and plastic adhesion for LCD & substrates
  • Coating, sealant, coil, IGBT, and transformer applications
  • Optical and medical component adhesive
Material Specifications
Uncured Material Properties
Component Property Value
TIE™ 280-12A (Resin) Color Black
Viscosity @25℃ Brookfield 3,000 cPs
Specific Gravity 1.6 g/cc
Shelf life @25℃ in sealed container 12 months
TIE™ 280-12B (Hardener) Color Black
Viscosity @25℃ Brookfield 5,000 cPs
Shelf life @25℃ in sealed container 12 months
Mixing and Curing Parameters
Parameter Value
Mix Ratio (By weight) TIE™ 280-12A : TIE™ 280-12B = 100 : 100
Viscosity @25℃ 4,000 cPs
Working pot life (250 g @25℃) 45 minutes
Specific Gravity 1.6 g/cc
Cure Schedule 12 hours at 25℃ or 30 minutes at 70℃
Cured Material Properties
Property Value
Hardness @25℃ 85 Shore D
Service temperature -40℃ to +130℃
Glass transition temperature Tg 92℃
Elongation 0.10%
Coefficient of thermal expansion 3.0 × 10⁻⁵ /℃
Fire resistance UL Meet 94 V-0
Moisture absorption % wt gain (24h water immersion @25℃) 0.1
Thermal and Electrical Properties
Property Value
Thermal Impedance @10psi 0.36 ℃-in²/W
Dielectric Strength 300 volts / mil
Dielectric Constant 4.2 MHz
Dissipation factor 0.029 MHz
Volume resistivity @25℃ 3.0 × 10¹² ohm-cm
TIE™ 280-12AB Two Component Epoxy Thermal Conductive Glue product packaging and application example

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Co., Ltd
Location No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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