TIF™100-20-10F Series Thermal Conductive Pad 2.0W/mK with UL94 V0 Rating and Multiple Thickness Options

Price Negotiable

Price: negotiation

MOQ: 1000pcs

Delivery Time: 3-5 work days

Brand: ZIITEK

Product Description

TIF™100-20-10F Series Thermal Conductive Pad

These thermally conductive interface materials are designed to fill air gaps between heating elements and heat dissipation components. Their flexibility and elasticity make them ideal for coating uneven surfaces, effectively transferring heat to metal housings or dissipation plates to enhance the efficiency and lifespan of electronic components.

Key Features

Excellent thermal conductivity: 2.0 W/mK
Naturally adhesive surface requires no additional coating
Soft and compressible for low-stress applications
Available in various thickness options

Applications

Cooling components to chassis or frame
High-speed mass storage drives
LED TV backlight units and LED lighting systems
RDRAM memory modules
Micro heat pipe thermal solutions
Automotive engine control units
Telecommunication hardware
Handheld portable electronics
Semiconductor automated test equipment (ATE)

Technical Specifications

Property	Value	Test Method	Thickness	Thermal Impedance @10psi (℃-in²/W)
Construction & Composition	Ceramic filled silicone rubber	-	10mils / 0.254 mm	0.36
Specific Gravity	2.75 g/cc	ASTM D297	20mils / 0.508 mm	0.41
Heat Capacity	1 J/g-K	ASTM C351	30mils / 0.762 mm	0.47
Hardness	45 Shore 00	ASTM 2240	40mils / 1.016 mm	0.52
Tensile Strength	45 psi	ASTM D412	50mils / 1.270 mm	0.58
Continuous Use Temperature	-50 to 200℃	-	60mils / 1.524 mm	0.65
Dielectric Breakdown Voltage	>10000 VAC	ASTM D149	70mils / 1.778 mm	0.72
Dielectric Constant	5.5 MHz	ASTM D150	80mils / 2.032 mm	0.79
Volume Resistivity	7.8×10¹⁴ Ohm-meter	ASTM D257	90mils / 2.286 mm	0.87
Fire Rating	94 V0	UL equivalent	100mils / 2.540 mm	0.94
Thermal Conductivity	2.0 W/m-K	ASTM D5470	110mils / 2.794 mm	1.01