The TIF ™100-50-10F Series thermally conductive interface materials are engineered to fill air gaps between heating elements and heat dissipation components. Their exceptional flexibility and elasticity enable effective coating of uneven surfaces, facilitating efficient heat transfer from electronic components to metal housings or dissipation plates, thereby enhancing component performance and longevity.

• High thermal conductivity: 5.0 W/mK
• Naturally adhesive surface requiring no additional coatings
• Soft and compressible design for low-stress applications
• Available in multiple thickness options
• 60 Shore 00 hardness rating

• RDRAM memory modules cooling
• LED TV backlight units and LED lighting systems
• High-speed mass storage drives
• Automotive engine control units
• Telecommunication hardware
• Handheld portable electronics
• Semiconductor automated test equipment
• Micro heat pipe thermal solutions

Our manufacturing philosophy emphasizes precision, thorough quality control, and responsive customer service. We maintain complete teamwork across sales, marketing, engineering, R&D, manufacturing, and logistics departments to ensure complete customer satisfaction.