TIF™100-25-11U Series 2.5W/mK Thermal Gap Pad - 25 Shore 00 Hardness for CPU Heatsinks
Price:
Negotiation
MOQ:
1000pcs
Delivery Time:
3-5 work days
Brand:
ZIITEK
Product Description
TIF™100-25-11U Series Thermally Conductive Gap Pad
A highly compliant, fiberglass-reinforced thermal interface material designed for fragile electronic components with excellent thermal conductivity of 2.5W/mK and operating temperature range of -50°C to 200°C.
Key Features
- Excellent thermal conductivity: 2.5W/mK
- Soft 25 Shore 00 hardness for low stress applications
- High tack surface reduces thermal contact resistance
- Fiberglass reinforced for improved puncture resistance
- RoHS compliant and UL recognized
- 94V-0 fire rating equivalent
- Inherent tack eliminates need for adhesive layers
Applications
- Memory modules and mass storage devices
- Automotive electronics and IT infrastructure
- Set top boxes and audio/video components
- GPS navigation and portable devices
- CD-ROM/DVD-ROM cooling systems
- LED power supply applications
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 2.5 W/m·K | ASTM D5470 |
| Hardness | 25 Shore 00 | ASTM 2240 |
| Operating Temperature | -50°C to 200°C | - |
| Specific Gravity | 2.35 g/cc | ASTM D297 |
| Dielectric Breakdown Voltage | >5000 VAC | ASTM D149 |
| Volume Resistivity | 4.0 × 10¹³ Ω·m | ASTM D257 |
| Outgassing (TML) | 0.55% | ASTM E595 |
Available Configurations
Standard Sheet Sizes: 8" × 16" (203mm × 406mm) or 16" × 18" (406mm × 457mm)
Standard Thickness: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"
Custom configurations and individual die-cut shapes available upon request.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Co., Ltd
Location
No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai