TIF™100-25-11U Series 2.5W/mK Thermal Gap Pad - 25 Shore 00 Hardness for CPU Heatsinks
Price:
Negotiation
MOQ:
1000pcs
Delivery Time:
3-5 work days
Brand:
ZIITEK
Product Description
TIF™100-25-11U Series Thermally Conductive Gap Pad
A highly compliant, fiberglass-reinforced thermal interface material designed for fragile electronic components with excellent thermal conductivity of 2.5W/mK and operating temperature range of -50°C to 200°C.
Key Features
- Excellent thermal conductivity: 2.5W/mK
- Soft 25 Shore 00 hardness for low stress applications
- High tack surface reduces thermal contact resistance
- Fiberglass reinforced for improved puncture resistance
- RoHS compliant and UL recognized
- 94V-0 fire rating equivalent
- Inherent tack eliminates need for adhesive layers
Applications
- Memory modules and mass storage devices
- Automotive electronics and IT infrastructure
- Set top boxes and audio/video components
- GPS navigation and portable devices
- CD-ROM/DVD-ROM cooling systems
- LED power supply applications
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 2.5 W/m·K | ASTM D5470 |
| Hardness | 25 Shore 00 | ASTM 2240 |
| Operating Temperature | -50°C to 200°C | - |
| Specific Gravity | 2.35 g/cc | ASTM D297 |
| Dielectric Breakdown Voltage | >5000 VAC | ASTM D149 |
| Volume Resistivity | 4.0 × 10¹³ Ω·m | ASTM D257 |
| Outgassing (TML) | 0.55% | ASTM E595 |
Available Configurations
Standard Sheet Sizes: 8" × 16" (203mm × 406mm) or 16" × 18" (406mm × 457mm)
Standard Thickness: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"
Custom configurations and individual die-cut shapes available upon request.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronic Materials & Technology Ltd.
Location
No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai