TIA800FG Series Blue Thermal Adhesive Tape 0.8 W/mK for Heat Sinks - 10" x 400' Size Options
The TIA™800FG Series blue thermal adhesive tape provides superior bonding strength with low thermal impedance (0.8 W/mK), making it ideal for bonding heat dissipation fins, microprocessors, and power semiconductors. This double-sided pressure-sensitive tape effectively replaces traditional methods like lubricating grease and mechanical fixing.
- Thermal Conductivity: 0.8 W/mK
- High bond strength to various surfaces
- Double-sided pressure sensitive adhesive
- High-performance thermally conductive acrylic adhesive
- Fiberglass reinforced backing for durability
- Mount heat sinks onto BGA graphic processors or drive processors
- Attach heat spreaders onto power converter PCBs or motor control PCBs
- Alternative to heat cure adhesives, screw mounting, or clip mounting
| Property | TIA™805FG | TIA™806FG | TIA™808FG | TIA™810FG | TIA™815FG | TIA™820FG | Test Method |
|---|---|---|---|---|---|---|---|
| Composite Thickness | 0.005" (0.127mm) | 0.006" (0.152mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | 0.015" (0.381mm) | 0.020" (0.508mm) | ASTM D374 |
| Aluminum Foil Thickness | ±0.001" (±0.025mm) | ±0.001" (±0.025mm) | ±0.0012" (±0.03mm) | ±0.0012" (±0.03mm) | ±0.0015" (±0.038mm) | ±0.002" (±0.05mm) | ASTM D374 |
| Voltage Breakdown | >2000 Vac | >2000 Vac | >2300 Vac | >3000 Vac | >3500 Vac | >3500 Vac | ASTM D149 |
| Thermal Impedance @50psi | 0.52℃-in²/W | 0.59℃-in²/W | 0.83℃-in²/W | 0.91℃-in²/W | 1.15℃-in²/W | 1.43℃-in²/W | ASTM D5470 |
Peel Adhesion: 1200 g/inch² (JIS K02378)
Holding Power 25℃/Days: >120 kg/inch² (JIS K023711)
Holding Power 120℃/Hours: >10 kg/inch² (JIS K023711)
Recommend Using Pressure: 10 psi
Thermal Conductivity: 0.8 W/mK
Standard Thicknesses: 0.005" (0.127mm), 0.006" (0.152mm), 0.008" (0.203mm), 0.010" (0.254mm), 0.015" (0.381mm), 0.020" (0.508mm)
Standard Sizes: 10" x 18" (254mm x 457mm), 10" x 400' (254mm x 121.9M)
Custom Options: Individual die cut shapes and alternate thicknesses available upon request
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