Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
Verified Supplier
20 Years
Since 2006
Menu

TIA800FG Series Blue Thermal Adhesive Tape 0.8 W/mK for Heat Sinks - 10" x 400' Size Options

Price Negotiable
Price: Negotiable
MOQ: 10SQM
Delivery Time: 2-3Work day
Brand: Ziitek
Product Description
TIA™800FG Series Thermal Adhesive Tape
Product Overview

The TIA™800FG Series blue thermal adhesive tape provides superior bonding strength with low thermal impedance (0.8 W/mK), making it ideal for bonding heat dissipation fins, microprocessors, and power semiconductors. This double-sided pressure-sensitive tape effectively replaces traditional methods like lubricating grease and mechanical fixing.

Key Features
  • Thermal Conductivity: 0.8 W/mK
  • High bond strength to various surfaces
  • Double-sided pressure sensitive adhesive
  • High-performance thermally conductive acrylic adhesive
  • Fiberglass reinforced backing for durability
Applications
  • Mount heat sinks onto BGA graphic processors or drive processors
  • Attach heat spreaders onto power converter PCBs or motor control PCBs
  • Alternative to heat cure adhesives, screw mounting, or clip mounting
Technical Specifications
Property TIA™805FG TIA™806FG TIA™808FG TIA™810FG TIA™815FG TIA™820FG Test Method
Composite Thickness 0.005" (0.127mm) 0.006" (0.152mm) 0.008" (0.203mm) 0.010" (0.254mm) 0.015" (0.381mm) 0.020" (0.508mm) ASTM D374
Aluminum Foil Thickness ±0.001" (±0.025mm) ±0.001" (±0.025mm) ±0.0012" (±0.03mm) ±0.0012" (±0.03mm) ±0.0015" (±0.038mm) ±0.002" (±0.05mm) ASTM D374
Voltage Breakdown >2000 Vac >2000 Vac >2300 Vac >3000 Vac >3500 Vac >3500 Vac ASTM D149
Thermal Impedance @50psi 0.52℃-in²/W 0.59℃-in²/W 0.83℃-in²/W 0.91℃-in²/W 1.15℃-in²/W 1.43℃-in²/W ASTM D5470
Additional Specifications

Peel Adhesion: 1200 g/inch² (JIS K02378)

Holding Power 25℃/Days: >120 kg/inch² (JIS K023711)

Holding Power 120℃/Hours: >10 kg/inch² (JIS K023711)

Recommend Using Pressure: 10 psi

Thermal Conductivity: 0.8 W/mK

Available Options

Standard Thicknesses: 0.005" (0.127mm), 0.006" (0.152mm), 0.008" (0.203mm), 0.010" (0.254mm), 0.015" (0.381mm), 0.020" (0.508mm)

Standard Sizes: 10" x 18" (254mm x 457mm), 10" x 400' (254mm x 121.9M)

Custom Options: Individual die cut shapes and alternate thicknesses available upon request

TIA800FG Series Thermal Adhesive Tape product image showing blue thermal tape roll and application examples

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

Request A Quote

Please check your email address.
Your message must be at least 20 characters.