Glass Fiber Thermal Adhesive Tape 0.8 W/mK Conductivity 0.020" Thickness for LED Heat Sink Mounting
The TIA™808FG Series thermal adhesive tape is engineered for bonding heat dissipation fins, microprocessors, and power consumption semiconductors. This double-sided pressure sensitive adhesive delivers exceptional bonding strength with low thermal impedance, effectively replacing traditional methods like lubricating grease and mechanical fixing.
- Thermal Conductivity: 0.8 W/mK
- High bond strength to various surfaces
- High-performance thermally conductive acrylic adhesive
- Glass fiber reinforced backing for durability
- Mount heat sink onto BGA graphic processors or drive processors
- Mount heat spreader onto power converter PCBs or motor control PCBs
- Alternative to heat cure adhesives, screw mounting, or clip mounting
| Parameter | Value | Test Method |
|---|---|---|
| Product Name | TIA™808FG | - |
| Color | White | Visual |
| Adhesive Type | Acrylic Adhesive | - |
| Backing Type | Glass fiber | - |
| Composite Thickness | 0.020" (0.203mm) | ASTM D374 |
| Aluminum Foil Thickness | ±0.0012" (±0.03mm) | ASTM D374 |
| Voltage Breakdown | > 2300 Vac | ASTM D149 |
| Peel Adhesion | 1200 g/inch² | JIS K02378 |
| Holding Power 25℃/Days | > 120 kg/inch² | JIS K023711 |
| Holding Power 120℃/Hours | > 10 kg/inch² | JIS K023711 |
| Recommend Using Pressure | 10 psi | - |
| Thermal Conductivity | 0.8 W/mK | - |
| Thermal Impedance @50psi | 0.83℃-in²/W | ASTM D5470 |
0.005" (0.127mm), 0.006" (0.152mm), 0.008" (0.203mm), 0.010" (0.254mm), 0.015" (0.381mm), 0.020" (0.508mm)
Consult the factory for alternate thickness requirements.
10" x 18" (254mm x 457mm), 10" x 400' (254mm x 121.9M)
Individual die cut shapes available upon request.
TIA™800 Series sheets feature fiberglass reinforcement for enhanced structural integrity and performance.
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