TIC™803Y Thermal Phase Change Material 0.95 W/mK with 0.024℃-in²/W Thermal Impedance
Price:
negotiation
MOQ:
1000PCS
Delivery Time:
3-5 work days
Brand:
Ziitek
Product Description
TIC™803Y Series Low Melting Point Thermal Phase Change Materials
The TIC™803Y Series is a specialized low melting point thermal interface material designed for advanced thermal management applications. At 50°C, the material begins to soften and flow, effectively filling microscopic irregularities on both thermal solution and integrated circuit package surfaces to significantly reduce thermal resistance.
This thermal phase change material remains a flexible solid at room temperature and operates freestanding without reinforcing components that could compromise thermal performance.
Performance and Reliability
The TIC™803Y Series demonstrates exceptional thermal stability with no performance degradation after 1,000 hours at 130°C or after 500 thermal cycles from -25°C to 125°C. The material softens appropriately without fully changing state, resulting in minimal migration (pump out) at operating temperatures.
Key Features
- No heat sink preheating required
- Low thermal resistance of 0.024℃-in²/W
- High thixotropic index for optimal application
- Dry to the touch for pre-apply applications
- High thermal reliability with minimal pump out
- Re-flow compatible for manufacturing efficiency
- Cost-effective thermal management solution
- Low volatility - less than 1%
- Easy to handle in manufacturing environments
- Flows but doesn't run like conventional thermal grease
- Available in custom die-cut shapes and kiss-cut on rolls
- Ideal for applications where electrical isolation is not required
Applications
Primary Applications:
High Frequency Microprocessors
Notebook and Desktop PCs
Computer Servers
Memory Modules
Cache Chips
IGBTs (Insulated Gate Bipolar Transistors)
Telecommunication Equipment
Technical Specifications
| Property | TIC™803Y | TIC™805Y | TIC™808Y | TIC™810Y | Testing Standards |
|---|---|---|---|---|---|
| Color | Yellow | Yellow | Yellow | Yellow | Visual |
| Composite Thickness | 0.003" (0.076mm) | 0.005" (0.126mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | |
| Thickness Tolerance | ±0.0006" (±0.016mm) | ±0.0008" (±0.019mm) | ±0.0008" (±0.019mm) | ±0.0012" (±0.030mm) | |
| Thermal Impedance @ 50 psi | 0.021℃-in²/W 0.14℃-cm²/W |
0.024℃-in²/W 0.15℃-cm²/W |
0.053℃-in²/W 0.34℃-cm²/W |
0.080℃-in²/W 0.52℃-cm²/W |
ASTM D5470 (modified) |
General Properties
Density: 2.2 g/cc (Helium Pycnometer)
Operating Temperature: -25°C to 125°C
Phase Transition Temperature: 50°C to 60°C
Thermal Conductivity: 0.95 W/mK (ASTM D5470 modified)
Available Thickness Options
Standard thicknesses include 0.003" (0.076mm), 0.005" (0.127mm), 0.008" (0.203mm), and 0.010" (0.254mm). Consult the factory for alternate thickness requirements.
Standard Sizes
Available in standard sizes of 9" x 18" (228mm x 457mm) and 9" x 400' (228mm x 121M). TIC™800 series products are supplied with white release paper and bottom liner, available in kiss-cut with extended pull tab liner or individual die-cut shapes.
Additional Information
Pressure sensitive adhesive is not applicable for TIC™800 series products. No reinforcement is necessary for optimal performance.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronic Materials & Technology Ltd.
Location
No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai