TIF100-20-05S Blue Thermal Conductive Pad 2.0W/mK for CPU Heat Dissipation with 2.95g/cc Specific Gravity

The TIF100-20-05S thermally conductive interface material is designed to fill air gaps between heating elements and heat dissipation components. Its flexibility and elasticity make it ideal for coating uneven surfaces, effectively transferring heat to metal housings or dissipation plates to enhance the efficiency and lifespan of heat-generating electronic components.

• High thermal conductivity: 2.0 W/mK
• Naturally tacky surface requiring no additional adhesive
• Soft and compressible for low-stress applications
• Available in various thickness options
• Specific gravity: 2.95 g/cc

• Cooling components to chassis or frame
• High-speed mass storage drives
• LED TV backlight units and LED lighting
• RDRAM memory modules
• Micro heat pipe thermal solutions
• Automotive engine control units
• Telecommunication hardware
• Handheld portable electronics
• Semiconductor automated test equipment (ATE)

Standard thicknesses range from 0.010" (0.25mm) to 0.200" (5.08mm) in 0.010" increments. Custom thicknesses available upon request.

• 8" x 16" (203mm x 406mm)
• 16" x 18" (406mm x 457mm)

• Pressure sensitive adhesive available (A1 for single side, A2 for double side)
• Fiberglass reinforcement available
• Custom die-cut shapes available