Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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TIF140-15-07E Thermally Conductive Interface Material Pad 1.5 W/mK Thermal Conductivity 0.010-0.200 Inch Thickness

Price Negotiable
Price: Negotiation
MOQ: 1000pcs
Delivery Time: 3-5work days
Brand: ZIITEK
Product Description
TIF140-15-07E Thermally Conductive Interface Material
The TIF140-15-07E thermally conductive interface materials are designed to fill air gaps between heating elements and heat dissipation components. Their flexibility and elasticity make them ideal for coating uneven surfaces, enabling efficient heat transfer from electronic components to metal housings or cooling plates, thereby enhancing component efficiency and lifespan.
Key Features
Thermal Performance
Excellent thermal conductivity of 1.5 W/mK with low thermal impedance
Application Benefits
Naturally tacky surface requires no additional adhesive coating
Material Properties
Soft and compressible for low-stress applications
Versatility
Available in multiple thicknesses from 0.010" to 0.200"
Technical Specifications
Property Value Test Method
Construction & Composition Ceramic filled silicone rubber -
Specific Gravity 2.10 g/cc ASTM D297
Heat Capacity 1 J/g-K ASTM C351
Hardness 27/35/45/60 (Shore 00) ASTM 2240
Tensile Strength 40 psi ASTM D412
Continuous Use Temperature -50 to 200℃ -
Dielectric Breakdown Voltage >1500~>5500 VAC ASTM D149
Dielectric Constant 5.5 MHz ASTM D150
Volume Resistivity 4.0×10¹² Ohm-meter ASTM D257
Fire Rating 94 V0 equivalent UL
Thermal Conductivity 1.5 W/m-K ASTM D5470
Thermal Impedance vs. Thickness
Thickness Thermal Impedance @10psi (℃-in²/W)
10mils / 0.254 mm 0.55
20mils / 0.508 mm 0.82
30mils / 0.762 mm 1.01
40mils / 1.016 mm 1.11
50mils / 1.270 mm 1.27
60mils / 1.524 mm 1.45
70mils / 1.778 mm 1.61
80mils / 2.032 mm 1.77
90mils / 2.286 mm 1.91
100mils / 2.540 mm 2.05
Applications
  • Cooling components to chassis or frame
  • High-speed mass storage drives
  • LED TV and LED-lit lamps heat sinking
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Telecommunication hardware
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
Available Options
Standard Thicknesses
0.010" (0.25mm), 0.020" (0.51mm), 0.030" (0.76mm), 0.040" (1.02mm), 0.050" (1.27mm), 0.060" (1.52mm), 0.070" (1.78mm), 0.080" (2.03mm), 0.090" (2.29mm), 0.100" (2.54mm), 0.110" (2.79mm), 0.120" (3.05mm), 0.130" (3.30mm), 0.140" (3.56mm), 0.150" (3.81mm), 0.160" (4.06mm), 0.170" (4.32mm), 0.180" (4.57mm), 0.190" (4.83mm), 0.200" (5.08mm)
Standard Sheet Sizes
8" x 16" (203mm x 406mm), 16" x 18" (406mm x 457mm)
Adhesive Options
Pressure sensitive adhesive available on one side (A1 suffix) or double side (A2 suffix)
Reinforcement
Fiberglass reinforced options available
TIF140-15-07E thermally conductive interface material sample and application examples
Company Advantages
  • Core competency in thermal conductive interface materials
  • Competitive advantage products with quality assurance
  • Free samples available for evaluation
  • Confidentiality agreements and business secret contracts
  • Total quality control philosophy: "Do it right the First time"

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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