Naturally tacky blue thermal conductive interface material designed for efficient CPU heat dissipation applications. This RoHS compliant pad features 1.5 W/mK thermal conductivity and 35 Shore 00 hardness for optimal performance in electronic cooling systems.

The TIF100-05E Series thermally conductive interface materials fill air gaps between heating elements and heat dissipation components. Their flexibility and elasticity accommodate uneven surfaces, enabling efficient heat transfer from electronic components to metal housings or dissipation plates, thereby enhancing component efficiency and lifespan.

• 1.5 W/mK thermal conductivity for efficient heat transfer
• Naturally tacky surface requiring no additional adhesive coating
• Soft and compressible design for low stress applications
• Available in multiple thickness options from 0.25mm to 5.08mm
• 35 Shore 00 hardness for optimal conformability

• Cooling components to chassis or frame
• High-speed mass storage drives
• LED TV backlight units and LED lighting systems
• RDRAM memory modules
• Micro heat pipe thermal solutions
• Automotive engine control units
• Telecommunication hardware
• Handheld portable electronics
• Semiconductor automated test equipment (ATE)

Standard thicknesses range from 0.010" (0.25mm) to 0.200" (5.08mm). Consult factory for alternate thickness requirements.

• 8" x 16" (203mm x 406mm)
• 16" x 18" (406mm x 457mm)

TIF™ series individual die cut shapes available upon request.

• Pressure sensitive adhesive: A1 suffix for one side, A2 suffix for double side
• Fiberglass reinforcement available for sheet types

Ziitek Electronic Material and Technology Ltd. specializes in R&D and production of thermal conductive materials, offering advanced production equipment and optimized processes to provide comprehensive thermal solutions for diverse applications.