Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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TIF120FG-30-25S Thermal Gap Filler Pad - 3.0 W/mK Thermal Conductivity, 5.5 MHz Dielectric Constant for LED Cooling

Price Negotiable
Price: negotiation
MOQ: 1000pcs
Delivery Time: 3-5work days
Brand: ZIITEK
Product Description
Product Overview
TIF120FG-30-25S thermal gap filler pads are engineered to fill air gaps between heating elements and heat dissipation components. Their flexibility and elasticity make them ideal for coating uneven surfaces, effectively transferring heat to metal housings or dissipation plates to enhance the efficiency and lifespan of heat-generating electronic components.
Key Features
  • High thermal conductivity: 3.0 W/mK
  • Naturally tacky surface requiring no additional adhesive
  • Soft and compressible for low-stress applications
  • Available in various thickness options
  • Excellent dielectric properties with 5.5 MHz dielectric constant
  • UL 94 V0 fire rating for safety compliance
Applications
  • LED lighting systems (TVs, lamps, backlight units)
  • High-speed mass storage drives
  • Telecommunication hardware
  • Automotive engine control units
  • Portable electronics and handheld devices
  • Semiconductor automated test equipment (ATE)
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
Technical Specifications
Property Value Test Method
Thermal Conductivity 3.0 W/mK ASTM D5470
Dielectric Constant 5.5 MHz ASTM D150
Volume Resistivity 4.0×10¹⁵ Ohm-meter ASTM D257
Continuous Use Temperature -50°C to 200°C -
Fire Rating 94 V0 UL equivalent
Hardness 27/35/45/60 (Shore 00) ASTM 2240
Tensile Strength 40 psi ASTM D412
Available Thickness Options
Standard thicknesses range from 0.010" (0.25mm) to 0.200" (5.08mm) in multiple increments. Consult factory for alternate thickness requirements.
Standard Sheet Sizes
  • 8" x 16" (203mm x 406mm)
  • 16" x 18" (406mm x 457mm)
Customization Options
  • Pressure sensitive adhesive available (single or double side)
  • Fiberglass reinforcement available
  • Individual die-cut shapes upon request
TIF120FG-30-25S thermal gap filler pad product image
Quality Assurance
  • Total quality control philosophy: "Do it right the first time"
  • Free samples available for evaluation
  • Quality assurance contracts provided
  • Business confidentiality agreements
Frequently Asked Questions
Q: How can we get detailed price list?
A: Please provide detailed product specifications including size (length, width, thickness), color, packaging requirements, and purchasing quantity.
Q: What kind of packaging you offer?
A: We implement preventive measures during packaging to ensure products remain in optimal condition during storage and delivery.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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