Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
Verified Supplier
20 Years
Since 2006
Menu
Office & School Supplies Other Office & School Supplies

TIF160-40-10S Thermal Gap Filler 4.0W/mK Grey Silicone Rubber Pad for Handheld Electronics

Price Negotiable
Price: negotiation
MOQ: 1000pcs
Delivery Time: 3-5work days
Brand: ZIITEK
Product Description
TIF160-40-10S Thermal Gap Filler Overview

This ceramic-filled silicone rubber thermal gap filler is engineered for handheld portable electronics and applications requiring minimal component pressure. The viscoelastic material provides excellent vibration dampening and shock absorption while maintaining flexibility for uneven surfaces.

Key Features
  • High thermal conductivity: 4.0 W/mK
  • Naturally tacky surface eliminates need for additional adhesives
  • Soft and compressible design for low-stress applications
  • Available in multiple thickness options from 0.010" to 0.200"
Primary Applications
  • Cooling components to chassis or frame
  • High-speed mass storage drives
  • LED TV backlight units and lighting systems
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Telecommunication hardware
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
Technical Specifications
Property Value Test Method
Color Grey Visual
Construction & Composition Ceramic filled silicone rubber -
Specific Gravity 2.10 g/cc ASTM D297
Heat Capacity 1 J/g-K ASTM C351
Hardness 45 (Shore 00) ASTM 2240
Tensile Strength 40 psi ASTM D412
Continuous Use Temperature -50 to 200°C -
Dielectric Breakdown Voltage >1500~>5500 VAC ASTM D149
Dielectric Constant 5.5 MHz ASTM D150
Volume Resistivity 4.0×10¹² Ohm-meter ASTM D257
Fire Rating 94 V0 equivalent UL
Thermal Conductivity 4.0 W/m-K ASTM D5470
Available Thickness Options
0.010" (0.25mm)
0.020" (0.51mm)
0.030" (0.76mm)
0.040" (1.02mm)
0.050" (1.27mm)
0.060" (1.52mm)
0.070" (1.78mm)
0.080" (2.03mm)
0.090" (2.29mm)
0.100" (2.54mm)
0.110" (2.79mm)
0.120" (3.05mm)
0.130" (3.30mm)
0.140" (3.56mm)
0.150" (3.81mm)
0.160" (4.06mm)
0.170" (4.32mm)
0.180" (4.57mm)
0.190" (4.83mm)
0.200" (5.08mm)

Consult factory for alternate thickness requirements.

Reinforcement Options

TIF™ series sheet types can be reinforced with fiberglass for enhanced structural integrity.

TIF thermal gap filler product application in electronic device
Manufacturing Information

Factory Size: 5,000-10,000 square meters

Location: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Annual Output Value: US$1 Million - US$2.5 Million

Technical Documentation

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

Request A Quote

Please check your email address.
Your message must be at least 20 characters.