Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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TIF100-50-05S Thermal Gap Filler Material - 5.0 W/mK Thermal Conductivity, 45 Shore 00 Hardness for Telecommunication Hardware

Price Negotiable
Price: Negotiation
MOQ: 1000pcs
Delivery Time: 3-5work days
Brand: ZIITEK
Product Description
TIF100-50-05S Thermal Gap Filler Material
High-performance thermal interface material designed for telecommunication hardware applications with 5.0 W/mK thermal conductivity and 45 Shore 00 hardness.
Product Overview
The TIF100-50-05S thermal gap filler is engineered to optimize heat transfer between components while providing insulation, damping, and sealing functions. This ceramic-filled silicone rubber material supports equipment miniaturization and ultra-thin design requirements across various thickness options.
Key Features
  • High thermal conductivity: 5.0 W/mK
  • Naturally tacky surface requiring no additional adhesive
  • Soft and compressible for low-stress applications
  • Multiple hardness options available
  • Excellent thermal performance characteristics
Applications
  • Motherboards and mainboards
  • LED TVs and lighting systems
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units and electronics
  • Handheld portable electronics
  • Semiconductor automated test equipment
  • GPS navigation and portable devices
Technical Specifications
PropertyValueTest Method
ColorBlueVisual
Construction & CompositionCeramic filled silicone rubber-
Specific Gravity2.75 g/ccASTM D297
Heat Capacity1 J/g-KASTM C351
Hardness45 Shore 00ASTM 2240
Tensile Strength45 psiASTM D412
Continuous Use Temperature-50 to 200°C-
Dielectric Breakdown Voltage>10000 VACASTM D149
Dielectric Constant5.5 MHzASTM D150
Volume Resistivity7.8×10¹⁴ Ohm-meterASTM D257
Fire Rating94 V0Equivalent UL
Thermal Conductivity5.0 W/m-KASTM D5470
Thermal Impedance Data
ThicknessThermal Impedance @10psi (°C-in²/W)
10mils / 0.254 mm0.36
20mils / 0.508 mm0.41
30mils / 0.762 mm0.47
40mils / 1.016 mm0.52
50mils / 1.270 mm0.58
60mils / 1.524 mm0.65
70mils / 1.778 mm0.72
80mils / 2.032 mm0.79
90mils / 2.286 mm0.87
100mils / 2.540 mm0.94
110mils / 2.794 mm1.01
120mils / 3.048 mm1.09
130mils / 3.302 mm1.17
140mils / 3.556 mm1.24
150mils / 3.810 mm1.34
160mils / 4.064 mm1.42
170mils / 4.318 mm1.50
180mils / 4.572 mm1.60
190mils / 4.826 mm1.68
200mils / 5.080 mm1.77
Product Options
Adhesive Options
A1 suffix: Pressure sensitive adhesive on one side
A2 suffix: Pressure sensitive adhesive on both sides
Standard Sheet Sizes
8" x 16" (203mm x 406mm)
Available Thicknesses
0.020" (0.51mm) to 0.200" (5.08mm) in various increments
Reinforcement Options
Fiberglass reinforced sheets available upon request
Packaging & Lead Time
Packaging includes PET film or foam protection, paper card separation between layers, and export cartons. Custom packaging available. Lead time for 5000 pieces: To be negotiated.
Quality Assurance
Our commitment to "Do it right the First time" ensures total quality control. We offer competitive thermal interface materials with confidentiality agreements, free samples, and quality assurance contracts.
TIF100-50-05S Thermal Gap Filler Material product image showing blue silicone rubber thermal pad

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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