TIF100-50-11S Silicone Thermal Pad 5.0W/mK for Automotive Electronics - 0.51mm to 5.08mm Thickness
The TIF100-50-11S thermal gap filler utilizes advanced silicone-based technology with ceramic fillers to provide exceptional thermal management for demanding automotive electronics applications. This flexible thermal interface material effectively reduces thermal resistance between heat sources and heat sinks, enhancing component efficiency and extending product lifespan.
- High thermal conductivity: 5.0 W/mK
- Naturally tacky surface eliminates need for additional adhesives
- Soft and compressible design for low-stress applications
- Available in multiple thickness options for precise fitting
- LED TV backlight units and lighting systems
- Automotive engine control units and electronics
- Telecommunication hardware and network equipment
- Portable electronics and handheld devices
- Semiconductor test equipment and memory modules
| Property | Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | - |
| Specific Gravity | 3.15 g/cc | ASTM D297 |
| Hardness | 45 (Shore 00) | ASTM 2240 |
| Continuous Use Temperature | -40 to 200℃ | - |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Thermal Conductivity | 5.0 W/m-K | ASTM D5470 |
| Fire Rating | 94 V0 | equivalent UL |
Custom thicknesses available upon request. Standard sheet size: 8" x 16" (203mm x 406mm). Individual die-cut shapes can be supplied.
Ziitek Company specializes in manufacturing advanced thermal management solutions including thermal conductive gap fillers, interface materials, insulators, tapes, and thermal greases. With comprehensive testing equipment and technical expertise, Ziitek delivers reliable thermal solutions for demanding electronic applications.
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