The TIF160-20-19F is an extremely soft gap filling material with 2.0W/m-K thermal conductivity, specially formulated for high-performance applications requiring low assembly stress. This ceramic-filled silicone elastomer offers exceptional thermal performance at low pressures due to its unique filler package and ultra-low modulus resin formulation.

• High thermal conductivity: 2.0 W/mK
• Naturally tacky surface requiring no additional adhesive
• Soft and compressible for low-stress applications
• Available in various thicknesses from 0.020" to 0.200"
• RoHS compliant and UL recognized
• Easy release construction with protective liners

• Cooling components to chassis or frame
• High-speed mass storage drives
• LED TV backlight units and LED lighting systems
• RDRAM memory modules and telecommunication hardware
• Handheld portable electronics and automotive electronics
• Set-top boxes, audio and video components

Standard thicknesses include: 0.020" (0.51mm), 0.030" (0.76mm), 0.040" (1.02mm), 0.050" (1.27mm), 0.060" (1.52mm), 0.070" (1.78mm), 0.080" (2.03mm), 0.090" (2.29mm), 0.100" (2.54mm), 0.110" (2.79mm), 0.120" (3.05mm), 0.130" (3.30mm), 0.140" (3.56mm), 0.150" (3.81mm), 0.160" (4.06mm), 0.170" (4.32mm), 0.180" (4.57mm), 0.190" (4.83mm), 0.200" (5.08mm). Consult factory for alternate thickness requirements.

Available in 8" × 16" (203mm × 406mm) and 16" × 18" (406mm × 457mm) formats. TIF™ series individual die-cut shapes can be supplied for custom applications.

Ziitek Electronic Material and Technology Ltd. specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. With extensive experience in thermal engineering, we provide customized products, comprehensive product lines, and flexible production capabilities to support your design requirements.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL.