TIE 280-25AB Thermal Conductive Epoxy Adhesive 2.5W/mK with 85 Shore D Hardness and -40℃ to 130℃ Range
Price:
0.1-100USD/KG
MOQ:
2KG/LOT
Delivery Time:
2-3 work day
Brand:
Ziitek
Product Description
TIE™ 280-25AB Thermal Conductive Epoxy Adhesive
Product Overview
TIE™ 280-25AB is a two-component, high thermal conductivity epoxy encapsulant compound featuring low viscosity, long pot life, and fire resistance. Designed for potting capacitors and electrical devices with excellent thermal management properties.
Key Features
- High thermal conductivity: 2.5W/mK
- Excellent electrical insulation with smooth surface finish
- Low shrinkage during curing process
- Low viscosity for easy application and air release
- Superior solvent resistance and waterproof properties
- Extended operational lifetime
- Excellent thermal shock efficiency and impact resistance
Applications
- Automotive starters potting and thermal detector potting
- Ferrite adhesion and TIP type LED applications
- Relay sealants with adhesion to rubber, ceramics, PCB and plastics
- Power transformers, coils, and capacitor potting
- Small electrical device encapsulation
- Metal, glass, and plastic adhesion for LCD & substrates
- Coating and sealant applications for optical/medical components
- IGBTs and transformer fire retardant solutions
Material Specifications
| Uncured Material Properties | |
|---|---|
| TIE™ 280-25A (Resin) | |
| Color | Black |
| Viscosity @25℃ Brookfield | 3,000 cPs |
| Specific Gravity | 2.1 g/cc |
| Shelf life @25℃ in sealed container | 12 months |
| TIE™ 280-25B (Hardener) | |
| Color | Black |
| Viscosity @25℃ Brookfield | 5,000 cPs |
| Shelf life @25℃ in sealed container | 12 months |
Processing Information
| Mix Ratio (By weight) | TIE™ 280-25A : TIE™ 280-25B = 100 : 100 |
| Viscosity @25℃ | 4,000 cPs |
| Working pot life (250 g @25℃) | 45 minutes |
| Specific Gravity | 2.1 g/cc |
| Cure Schedule | |
| Standard cure | 12 hours at 25℃ |
| Accelerated cure | 30 minutes at 70℃ |
Cured Material Properties
| Hardness @25℃ | 85 Shore D |
| Service temperature | -40℃ to +130℃ |
| Glass transition temperature Tg | 92℃ |
| Elongation | 0.10% |
| Coefficient of thermal expansion | 3.0 × 10⁻⁵ /℃ |
| Fire resistance UL | Meet 94 V-0 |
| Moisture absorption % wt gain (24h water immersion @25℃) | 0.1 |
Thermal & Electrical Properties
| Thermal Properties | |
|---|---|
| Thermal Conductivity | 2.5 W/m-K |
| Thermal Impedance @10psi | 0.31 ℃-in²/W |
| Electrical Properties (As Cured) | |
| Dielectric Strength | 300 volts / mil |
| Dielectric Constant | 4.2 MHz |
| Dissipation factor | 0.029 MHz |
| Volume resistivity, ohm-cm @ 25℃ | 3.0 × 10¹² |
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Co., Ltd
Location
No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai