Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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Chemicals Adhesives & Sealants

TIE 280-25AB Two-Component Thermal Conductive Glue 2.5W/mK for LED Lighting and Electrical Potting

Price Negotiable
Price: 0.1-10 USD/khối
MOQ: 2KG/LOT
Delivery Time: 2-3 work day
Brand: Ziitek
Product Description
Product Overview

TIE™ 280-25AB is a two-component, high thermal conductivity epoxy encapsulant compound with 2.5W/mK thermal conductivity, designed specifically for LED lighting applications and electrical device potting.

Key Features
  • High thermal conductivity: 2.5W/mK
  • Excellent electrical insulation properties
  • Low viscosity for easy application and air release
  • Superior solvent and water resistance
  • Excellent thermal shock efficiency and impact resistance
  • UL 94 V-0 fire resistance rating
  • Long pot life of 45 minutes at 25℃
  • Low shrinkage during curing
Applications
  • LED lighting thermal management
  • Automotive starters potting
  • Power transformers and coils
  • Capacitors and electrical devices potting
  • Ferrite adhesion and relay sealant
  • IGBTs and thermal detector potting
  • Optical and medical component adhesive
TIE 280-25AB thermal conductive glue product image
Technical Specifications
Uncured Material Properties
Component Property Value
TIE™ 280-25A (Resin) Color Black
Viscosity @25℃ 3,000 cPs
Specific Gravity 2.1 g/cc
Shelf Life @25℃ 12 months
TIE™ 280-25B (Hardener) Color Black
Viscosity @25℃ 5,000 cPs
Shelf Life @25℃ 12 months
Processing Parameters
Parameter Value
Mix Ratio (By Weight) TIE™ 280-25A : TIE™ 280-25B = 100 : 100
Viscosity @25℃ 4,000 cPs
Working Pot Life (250g @25℃) 45 minutes
Specific Gravity 2.1 g/cc
Cure Schedule 12 hours at 25℃ or 30 minutes at 70℃
Cured Properties
Property Value
Hardness @25℃ 85 Shore D
Service Temperature -40℃ to +130℃
Glass Transition Temperature 92℃
Elongation 0.10%
Coefficient of Thermal Expansion 3.0 × 10⁻⁵ /℃
Fire Resistance UL Meet 94 V-0
Moisture Absorption 0.1% wt gain (24h water immersion @25℃)
Thermal & Electrical Properties
Property Value
Thermal Conductivity 2.5 W/m-K
Thermal Impedance @10psi 0.31 ℃-in²/W
Dielectric Strength 300 volts/mil
Dielectric Constant 4.2 MHz
Dissipation Factor 0.029 MHz
Volume Resistivity @25℃ 3.0 × 10¹² ohm-cm
TIE 280-25AB thermal conductive glue technical specifications
Quality Certifications
  • ISO 9001:2015
  • ISO 14001:2004
  • IATF 16949:2016
  • IECQ QC 080000:2017
  • UL Certified
Manufacturer Information

Ziitek Electronic Material and Technology Ltd. specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. With extensive experience in thermal engineering, we provide customized products, full product lines, and flexible production capabilities to support your design requirements.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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