TIA™800FG Series Double-Sided Thermal Adhesive Tape with 0.8 W/mK Conductivity and Glass Fiber Backing
Price:
Negotiable
MOQ:
10SQM
Delivery Time:
2-3Work day
Brand:
Ziitek
Product Description
TIA™800FG Series Thermal Adhesive Tape
Product Overview
The TIA™800FG Series double-sided thermal adhesive tape features glass fiber backing with 0.8 W/mK thermal conductivity. Designed for bonding heat dissipation components, this high-performance tape provides superior thermal management with excellent bonding strength.
Key Features
- Thermal Conductivity: 0.8 W/mK
- High bond strength for various surfaces
- Performance acrylic adhesive system
- Replaces thermal grease and mechanical fasteners
- Glass fiber reinforced backing for durability
Applications
- Mounting heat sinks on BGA graphic processors
- Attaching heat spreaders to power converter PCBs
- Motor control PCB thermal management
- Alternative to heat cure adhesives and mechanical mounting
Technical Specifications
| Property | TIA™805FG | TIA™806FG | TIA™808FG | TIA™810FG | TIA™815FG | TIA™820FG | Test Method |
|---|---|---|---|---|---|---|---|
| Composite Thickness | 0.005" (0.127mm) | 0.006" (0.152mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | 0.015" (0.381mm) | 0.020" (0.508mm) | ASTM D374 |
| Voltage Breakdown | > 2000 Vac | > 2000 Vac | > 2300 Vac | > 3000 Vac | > 3500 Vac | > 3500 Vac | ASTM D149 |
| Thermal Impedance @50psi | 0.52℃-in²/W | 0.59℃-in²/W | 0.83℃-in²/W | 0.91℃-in²/W | 1.15℃-in²/W | 1.43℃-in²/W | ASTM D5470 |
Available Options
Standard Thicknesses: 0.005" (0.127mm), 0.006" (0.152mm), 0.008" (0.203mm), 0.010" (0.254mm), 0.015" (0.381mm), 0.020" (0.508mm)
Standard Sizes: 10" x 18" (254mm x 457mm), 10" x 400' (254mm x 121.9M)
Custom Options: Individual die cut shapes and alternate thicknesses available upon request
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronic Materials & Technology Ltd.
Location
No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai