TIA™800FG Series Double-Sided Thermal Adhesive Tape with 0.8 W/mK Conductivity and Glass Fiber Backing
Price:
Negotiable
MOQ:
10SQM
Delivery Time:
2-3Work day
Brand:
Ziitek
Product Description
TIA™800FG Series Thermal Adhesive Tape
Product Overview
The TIA™800FG Series double-sided thermal adhesive tape features glass fiber backing with 0.8 W/mK thermal conductivity. Designed for bonding heat dissipation components, this high-performance tape provides superior thermal management with excellent bonding strength.
Key Features
- Thermal Conductivity: 0.8 W/mK
- High bond strength for various surfaces
- Performance acrylic adhesive system
- Replaces thermal grease and mechanical fasteners
- Glass fiber reinforced backing for durability
Applications
- Mounting heat sinks on BGA graphic processors
- Attaching heat spreaders to power converter PCBs
- Motor control PCB thermal management
- Alternative to heat cure adhesives and mechanical mounting
Technical Specifications
| Property | TIA™805FG | TIA™806FG | TIA™808FG | TIA™810FG | TIA™815FG | TIA™820FG | Test Method |
|---|---|---|---|---|---|---|---|
| Composite Thickness | 0.005" (0.127mm) | 0.006" (0.152mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | 0.015" (0.381mm) | 0.020" (0.508mm) | ASTM D374 |
| Voltage Breakdown | > 2000 Vac | > 2000 Vac | > 2300 Vac | > 3000 Vac | > 3500 Vac | > 3500 Vac | ASTM D149 |
| Thermal Impedance @50psi | 0.52℃-in²/W | 0.59℃-in²/W | 0.83℃-in²/W | 0.91℃-in²/W | 1.15℃-in²/W | 1.43℃-in²/W | ASTM D5470 |
Available Options
Standard Thicknesses: 0.005" (0.127mm), 0.006" (0.152mm), 0.008" (0.203mm), 0.010" (0.254mm), 0.015" (0.381mm), 0.020" (0.508mm)
Standard Sizes: 10" x 18" (254mm x 457mm), 10" x 400' (254mm x 121.9M)
Custom Options: Individual die cut shapes and alternate thicknesses available upon request
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Co., Ltd
Location
No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai