Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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TIF120-20-07U Ultra Soft Thermal Interface Pad 1.5 W/mK 27 Shore 00 for Electronics Cooling

Price Negotiable
Price: negotiation
MOQ: 1000pcs
Delivery Time: 3-5work days
Brand: ZIITEK
Product Description
Ultra Soft Low Thermal Conductivity PAD TIF120-20-07U
Product Overview

The TIF120-20-07U thermally conductive interface materials are designed to fill air gaps between heating elements and heat dissipation components. Their exceptional flexibility and elasticity make them ideal for coating uneven surfaces, effectively transferring heat to metal housings or dissipation plates, thereby enhancing the efficiency and lifespan of heat-generating electronic components.

Technical Datasheet

Key Features
  • Thermal conductivity: 1.5 W/mK
  • Thickness: 0.5 mm
  • Hardness: 27 SHORE 00
  • Naturally tacky - no additional adhesive required
  • Soft and compressible for low stress applications
  • Available in various thickness options
Applications
  • Cooling components to chassis or frame
  • High-speed mass storage drives
  • LED TV backlight units and LED lighting
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Telecommunication hardware
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
Technical Specifications
Typical Properties
Property Value Test Method
Color Light Green Visual
Construction & Composition Ceramic filled silicone rubber -
Specific Gravity 2.10 g/cc ASTM D297
Heat Capacity 1 J/g-K ASTM C351
Hardness 27 Shore 00 ASTM 2240
Tensile Strength 40 psi ASTM D412
Continuous Use Temperature -40 to 160℃ -
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 3.5 MHz ASTM D150
Volume Resistivity 4.0×10¹² Ohm-meter ASTM D257
Fire Rating 94 V0 equivalent UL
Thermal Conductivity 1.5 W/m-K ASTM D5470
Thermal Impedance @10psi (℃-in²/W)
Composite Thickness Thermal Impedance
10mils / 0.254 mm 0.55
20mils / 0.508 mm 0.82
30mils / 0.762 mm 1.01
40mils / 1.016 mm 1.11
50mils / 1.270 mm 1.27
60mils / 1.524 mm 1.45
70mils / 1.778 mm 1.61
80mils / 2.032 mm 1.77
90mils / 2.286 mm 1.91
100mils / 2.540 mm 2.05
Standard Thickness Options

Available in thicknesses from 0.010" (0.25mm) to 0.200" (5.08mm). Contact factory for alternate thickness requirements.

Standard Sheet Sizes

8" x 16" (203mm x 406mm) and 16" x 18" (406mm x 457mm). Individual die cut shapes available upon request.

Custom Options

Pressure sensitive adhesive available on one side (A1 suffix) or double side (A2 suffix). Fiberglass reinforcement available for sheet types.

TIF120-20-07U Thermal Interface Material Product Image
Frequently Asked Questions
What's the thermal conductivity test method given on the data sheet?
All data in the sheet are actual tested values. Hot Disk and ASTM D5470 methods are utilized to test thermal conductivity.
How can we get detailed price list?
Please provide detailed product information including size (length, width, thickness), color, specific packaging requirements, and purchasing quantity.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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