Pink 3.0W/mK Thermal Conductive Pad TIF150-30-49U, 30 Shore 00 Hardness, -40°C to 160°C Operating Range

The TIF150-30-49U thermal conductive pad is a high-performance interface material designed to efficiently transfer heat from electronic components to heat dissipation surfaces. With a thermal conductivity of 3.0W/mK and excellent flexibility, this pink silicone-based pad effectively fills air gaps between heating elements and heat sinks or metal bases.

• High thermal conductivity: 3.0W/mK
• Naturally tacky surface requires no additional adhesive
• Soft and compressible for low-stress applications
• Available in multiple thickness options from 0.010" to 0.200"
• Excellent flexibility for uneven surface coverage

• LED TV backlight units and LED lighting systems
• High-speed mass storage drives
• Telecommunication hardware
• Automotive engine control units
• Semiconductor automated test equipment (ATE)
• Handheld portable electronics
• RDRAM memory modules
• Micro heat pipe thermal solutions

0.010" (0.25mm), 0.020" (0.51mm), 0.030" (0.76mm), 0.040" (1.02mm), 0.050" (1.27mm), 0.060" (1.52mm), 0.070" (1.78mm), 0.080" (2.03mm), 0.090" (2.29mm), 0.100" (2.54mm), 0.110" (2.79mm), 0.120" (3.05mm), 0.130" (3.30mm), 0.140" (3.56mm), 0.150" (3.81mm), 0.160" (4.06mm), 0.170" (4.32mm), 0.180" (4.57mm), 0.190" (4.83mm), 0.200" (5.08mm)

8" × 16" (203mm × 406mm), 16" × 18" (406mm × 457mm)

Individual die-cut shapes available. Pressure-sensitive adhesive options: single-side (A1 suffix) or double-side (A2 suffix). Fiberglass reinforcement available for sheet types.