Dongguan Ziitek Electronical Material and Technology Co., Ltd
                                                                                                           
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TIC™808P Series 0.95 W/mK Thermal Conductivity Phase Change Material for IGBTs and Processors

Price Negotiable
Price: negotiation
MOQ: 1000PCS
Delivery Time: 3-5 work days
Brand: Ziitek
Product Description
TIC™808P Series Phase Change Thermal Interface Materials
Product Overview

TIC™808P series are low melting point thermal interface materials designed for high-performance thermal management applications. At 50°C, the material softens and flows to fill microscopic surface irregularities, significantly reducing thermal resistance between components.

Key Applications
  • High Frequency Microprocessors
  • Notebook and Desktop PCs
  • Computer Servers
  • Memory Modules
  • Cache Chips
  • IGBTs (Insulated Gate Bipolar Transistors)
Product Features
  • 0.014℃-in²/W thermal resistance for optimal heat transfer
  • 0.95 W/mK thermal conductivity rating
  • Naturally tacky at room temperature - no adhesive required
  • No heat sink preheating required for installation
  • Flexible solid at room temperature, freestanding without reinforcing components
  • No thermal performance degradation after 1,000 hours at 130°C or 500 cycles from -25°C to 125°C
  • Minimal migration (pump out) at operating temperatures
Technical Specifications
Property TIC™803P TIC™805P TIC™808P TIC™810P Testing Standards
Color Pink Pink Pink Pink Visual
Composite Thickness 0.003" (0.076mm) 0.005" (0.126mm) 0.008" (0.203mm) 0.010" (0.254mm)
Thickness Tolerance ±0.0006" (±0.016mm) ±0.0008" (±0.019mm) ±0.0008" (±0.019mm) ±0.0012" (±0.030mm)
Thermal Impedance @ 50 psi 0.021℃-in²/W (0.14℃-cm²/W) 0.024℃-in²/W (0.15℃-cm²/W) 0.053℃-in²/W (0.34℃-cm²/W) 0.080℃-in²/W (0.52℃-cm²/W) ASTM D5470 (modified)
Additional Specifications
  • Density: 2.2 g/cc (Helium Pycnometer)
  • Operating Temperature Range: -25°C to 125°C
  • Phase Transition Temperature: 50°C to 60°C
  • Thermal Conductivity: 0.95 W/mK (ASTM D5470 modified)
Standard Thickness Options

0.005" (0.127mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | 0.012" (0.305mm)

Consult factory for alternate thickness requirements.

Standard Sizes
  • 10" x 16" (254mm x 406mm)
  • 16" x 400' (406mm x 121.92M)
Packaging & Configuration

TIC™800 series are supplied with white release paper and bottom liner. Available in kiss cut, extended pull tab liner, or individual die cut shapes to meet specific application requirements.

TIC™808P Series Phase Change Thermal Interface Material product image showing pink thermal pad

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Co., Ltd
Location No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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