TIC™800Y Series Phase Change Thermal Material 0.003-0.010" Thickness 0.95 W/mK Thermal Conductivity
Low melting point thermal interface material designed for high-performance thermal management in electronic devices. At 50℃, the material softens and flows to fill microscopic surface irregularities, significantly reducing thermal resistance.
- Low thermal resistance of 0.024℃-in²/W
- Naturally tacky at room temperature - no adhesive required
- No heat sink preheating required
- Flexible solid at room temperature, freestanding without reinforcement
- Excellent thermal stability: no degradation after 1,000 hours at 130℃ or 500 cycles from -25℃ to 125℃
- High Frequency Microprocessors
- Notebook and Desktop PCs
- Computer Servers
- Memory Modules and Cache Chips
- IGBTs and Telecommunication Equipment
| Property | TIC™803Y | TIC™805Y | TIC™808Y | TIC™810Y | Testing Standards |
|---|---|---|---|---|---|
| Color | Yellow | Yellow | Yellow | Yellow | Visual |
| Composite Thickness | 0.003" (0.076mm) | 0.005" (0.126mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | |
| Thickness Tolerance | ±0.0006" (±0.016mm) | ±0.0008" (±0.019mm) | ±0.0008" (±0.019mm) | ±0.0012" (±0.030mm) | |
| Thermal Impedance @ 50 psi | 0.021℃-in²/W (0.14℃-cm²/W) | 0.024℃-in²/W (0.15℃-cm²/W) | 0.053℃-in²/W (0.34℃-cm²/W) | 0.080℃-in²/W (0.52℃-cm²/W) | ASTM D5470 (modified) |
Thicknesses: 0.003" (0.076mm), 0.005" (0.127mm), 0.008" (0.203mm), 0.010" (0.254mm)
Sizes: 9" x 18" (228mm x 457mm), 9" x 400' (228mm x 121M)
Available with white release paper and bottom liner. Custom kiss cut, extended pull tab liner, or individual die cut shapes available.
Ziitek Company brings over 13 years of professional R&D experience in thermal interface materials, with unique formulations that represent our core technologies and competitive advantages.
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