Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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2.0W/MK Ceramic Filled Silicone Pink Thermal Conductive Pad Operating Temp -50 To 200℃ Thermal Gap Filler Pad

Price Negotiable
Price: negotiation
MOQ: 1000pcs
Delivery Time: 3-5work days
Brand: ZIITEK
Product Description

2.0W/MK Ceramic Filled Silicone Pink Thermal Conductive Pad Operating Temp -50 To 200℃ Thermal Gap Filler Pad

 

Products description

The TIF®100-20-50U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


Features:


>  Good thermal conductive: 2.0 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness


Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 

Typical Properties of TIF®100-20-50U Series
Color Pink Visual
Construction &Compostion Ceramic filled silicone elastomer *****
Specific Gravity 2.6 g/cc ASTM D297
Hardness 27 Shore 00 ASTM 2240
Thickness range 0.020"(0.5mm)~0.200“(5.0mm) ASTM D374
Continuos Use Temp -40 to 160℃ *****
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant @1MHz 4.9 MHz ASTM D150
Volume Resistivity 6.4X1013Ohm-cm ASTM D257
Fire rating 94 -V0 UL E331100
Thermal conductivity 2.0 W/m-K ASTM D5470
 
 
Product specification

Standard Sheets Sizes: 8" x 16"(203mm x 406mm) 
Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming.

Peressure Sensitive Adhesive:            
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
TIF™ series sheets type can add with fiberglass reinforced.
Company profile
 
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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