TIF100-30-49U Thermal Conductive Pad 3.0 W/mK Silicone Rubber Heat Sink Interface Material

The TIF100-30-49U Thermal Conductive Pad is a high-performance silicone rubber interface material designed for efficient heat transfer in electronic applications. With a thermal conductivity of 3.0 W/mK, this pad effectively fills air gaps between heat-generating components and cooling surfaces.

• Excellent thermal conductivity: 3.0 W/mK
• Naturally adhesive surface requires no additional coating
• Soft and compressible for low-stress applications
• Available in multiple thicknesses from 0.25mm to 5.08mm
• UL 94 V-0 fire rating for enhanced safety
• Operating temperature range: -50°C to 200°C

Standard thicknesses range from 0.25mm (0.010") to 5.08mm (0.200") with multiple intermediate options. Custom thicknesses available upon request.

• 8" x 16" (203mm x 406mm)
• 16" x 18" (406mm x 457mm)

• LED TV and lighting systems
• Power supply units
• Automotive engine control units
• Telecommunication hardware
• GPS navigation devices
• Semiconductor test equipment
• High-speed storage drives

• Pressure-sensitive adhesive (single or double-sided)
• Fiberglass reinforcement available
• Die-cut shapes to specification