3.0 W/mK Silicone Thermal Conductive Pad -50°C to 200°C Operating Range for Telecommunication Hardware
The TIF150-30-19S silicone thermal conductive pad is engineered to fill air gaps between heating elements and heat dissipation components, providing efficient thermal management for electronic devices operating from -50°C to 200°C.
- High thermal conductivity: 3.0 W/mK
- Naturally tacky surface eliminates need for additional adhesives
- Soft and compressible design for low-stress applications
- Available in multiple thickness options from 0.25mm to 5.08mm
- Excellent temperature resistance: -50°C to 200°C
- UL 94 V-0 fire rating for enhanced safety
- Telecommunication hardware and equipment
- LED lighting systems and displays
- Automotive engine control units
- High-speed mass storage drives
- Portable electronics and handheld devices
- Semiconductor test equipment
- Memory modules and micro heat pipe solutions
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 3.0 W/mK | ASTM D5470 |
| Operating Temperature | -50°C to 200°C | - |
| Hardness | 27/35/45/60 (Shore 00) | ASTM 2240 |
| Tensile Strength | 40 psi | ASTM D412 |
| Specific Gravity | 2.10 g/cc | ASTM D297 |
| Dielectric Breakdown Voltage | 1500-5500 VAC | ASTM D149 |
| Fire Rating | UL 94 V-0 | Equivalent UL |
8" x 16" (203mm x 406mm)
16" x 18" (406mm x 457mm)
Custom die-cut shapes available upon request
ISO9001:2015 • ISO14001:2004 • IATF16949:2016 • IECQ QC 080000:2017 • UL
Pressure Sensitive Adhesive: Available on one side (A1 suffix) or both sides (A2 suffix)
Reinforcement: Fiberglass reinforced versions available
Quality: Do it right the first time with total quality control
Effectiveness: Precise and thorough work processes
Service: Quick response, on-time delivery, and excellent customer support
Teamwork: Complete collaboration across sales, marketing, engineering, R&D, manufacturing, and logistics teams
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