Dongguan Ziitek Electronical Material and Technology Co., Ltd
                                                                                                           
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Since 2006
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Violet Thermal Gap Filler 1.5 W/mK for Micro Heat Pipe Thermal Solutions

Price Negotiable
Price: Negotiation
MOQ: 1000pcs
Delivery Time: 3-5work days
Brand: ZIITEK
Product Description
Black Thermal Conductivity Silicone Materials Thermal Gap Filler Pad 1.5 W/M-K For Micro Heat Pipe Thermal Solutions
Product Overview

The TIF®100-01S is engineered to optimize gap heat transfer by filling spaces between heating and cooling components. This advanced thermal interface material facilitates efficient heat transfer while providing insulation, damping, and sealing functions. It supports equipment miniaturization and ultra-thin design requirements with its wide thickness range and excellent thermal conductivity properties.

Key Features
  • Excellent thermal conductivity: 1.5 W/mK
  • Naturally tacky surface requiring no additional adhesive coating
  • Soft and compressible for low-stress applications
  • Available in various thicknesses to suit different requirements
Applications
  • Cooling components to chassis or frame
  • High-speed mass storage drives
  • Heat sinking housing at LED-lit BLU in LCD displays
  • LED TV and LED lighting systems
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Telecommunication hardware
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
Technical Specifications
Property Value Test Method
Color Black Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 2.1 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00
ASTM D374
Hardness (Shore 00) 65 | 45 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 4.5 ASTM D150
Volume Resistivity >1.0×10¹² Ohm-meter ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity 1.5 W/m-K ASTM D5470
ISO22007
Product Specifications

Product Thicknesses: 0.010" (0.25mm) ~ 0.200" (5.00mm) with increments of 0.010" (0.25mm)

Product Sizes: 16" x 16" (406mm x 406mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Black Thermal Conductivity Silicone Materials Thermal Gap Filler Pad
Why Choose Ziitek?
  • Our value message: "Do it right the First time, total quality control"
  • Core competencies in thermal conductive interface materials
  • Competitive advantage products
  • Confidentiality agreement and business secret contracts
  • Free sample offerings
  • Quality assurance contracts
Ziitek Culture

Quality: Do it right the first time, total quality control

Effectiveness: Work precisely and thoroughly for effectiveness

Service: Quick response, on-time delivery, and excellent service

Team Work: Complete teamwork across sales, marketing, engineering, R&D, manufacturing, and logistics teams to provide satisfying service for customers

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Co., Ltd
Location No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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