TIS™580-12 Series is a dealcoholized, single-component thermal conductive silicone adhesive that cures at room temperature. This advanced material provides excellent heat conduction and strong adhesion for electronic components, forming a high-hardness elastomer that firmly attaches to substrates and reduces thermal impedance for efficient heat transfer between heat sources, heat sinks, motherboards, and metal casings.

• Excellent thermal conductivity: 1.2W/mK
• Superior maneuverability and strong adhesion properties
• Low shrinkage during curing process
• Low viscosity ensures void-free surface application
• Excellent solvent and water resistance
• Extended working life for efficient application
• Outstanding thermal shock resistance

This thermal conductive adhesive serves as an effective replacement for traditional thermal pastes and pads, providing superior gap-filling capabilities and heat conduction between LED aluminum motherboards and heat sinks, high-power electrical modules and heat dissipation systems. It replaces conventional methods like fins and screw fixing, delivering more reliable thermal conduction, simplified handling, and cost-effective solutions.

Common applications include integrated circuits in portable computers, microprocessors, high-power LEDs, internal storage modules, cache systems, DC/AC translators, IGBT and power modules, semiconductor encapsulation, relay switches, rectifiers, and transformers.

Ziitek is a leading manufacturer specializing in thermal management solutions including thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive interface pads, thermal grease, thermal conductive plastics, silicone rubber, silicone foams, and phase changing materials. With comprehensive testing equipment and strong technical capabilities, Ziitek ensures product quality and performance excellence.