LED Lighting Thermal Phase Change Material Pad 0.95 W/mK Pink 0.254mm Low Thermal Resistance
LED lighting Thermal phase changing materials Interface Pad Pink Low Resistance 0.95 W/MK
The TIC™810P Series is low melting point thermal interface material. At 50℃, The TIC™810P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™810P Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™810P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
Features:
> 0.024℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
| Typical Properties of TIC™800P Series | |||||
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Product Name
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TICTM810P
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Testing standards
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Color
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Pink |
Visual
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Composite Thickness |
0.010"
(0.254mm) |
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Thickness Tolerance
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±0.0012"
(±0.030mm) |
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Density
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2.2g/cc
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Helium Pycnometer
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Work temperature
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-25℃～125℃
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phase transition temperature
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50℃~60℃
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Thermal conductivity
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0.95 W/mK
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ASTM D5470 (modified)
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Thermal lmpedance @ 50 psi(345 KPa)
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0.080℃-in²/W |
ASTM D5470 (modified)
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0.52℃-cm²/W
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0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.
Standard Sizes:
9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series products.
Reinforcement:
No reinforcement is necessary.
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