TIC™805Y Yellow Thermal Phase Change Material 0.95W/mK with 0.024°C-in²/W Thermal Resistance
The TIC™805Y Series is a low melting point thermal interface material designed for high-performance thermal management applications. At 50°C, the material begins to soften and flow, effectively filling microscopic irregularities between thermal solutions and integrated circuit package surfaces to minimize thermal resistance.
- Low thermal resistance of 0.024°C-in²/W
- Naturally tacky at room temperature - no adhesive required
- No heat sink preheating necessary
- Thermal conductivity: 0.95 W/mK
- Maintains performance after 1,000 hours at 130°C or 500 thermal cycles
| Property | Value | Testing Standard |
|---|---|---|
| Product Name | TIC™805Y | |
| Color | Yellow | Visual |
| Composite Thickness | 0.005" (0.126mm) | |
| Thickness Tolerance | ±0.0008" (±0.019mm) | |
| Density | 2.2 g/cc | Helium Pycnometer |
| Operating Temperature | -25°C to 125°C | |
| Phase Transition Temperature | 50°C to 60°C | |
| Thermal Conductivity | 0.95 W/mK | ASTM D5470 (modified) |
| Thermal Impedance @ 50 psi | 0.024°C-in²/W (0.15°C-cm²/W) | ASTM D5470 (modified) |
Standard thicknesses include: 0.003" (0.076mm), 0.005" (0.127mm), 0.008" (0.203mm), and 0.010" (0.254mm). Contact the factory for alternate thickness requirements.
Available in 9" x 18" (228mm x 457mm) sheets or 9" x 400' (228mm x 121M) rolls. The TIC™800 series is supplied with white release paper and bottom liner, available in kiss cut with extended pull tab liner or individual die cut shapes.
Pressure sensitive adhesive is not applicable for TIC™800 series products. No reinforcement is necessary as the material maintains structural integrity without additional support components.
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