2.0W/mK Thermal Silicone Pad - 27 Shore 00 Hardness LED Heat Dissipation Material for Floor Lighting
The TIF™100-20-23U thermal silicone pad is a high-performance thermal interface material designed for efficient heat dissipation in LED lighting applications. This light blue silicone pad features 2.0 W/mK thermal conductivity and excellent surface tackiness for reduced contact resistance.
2.0 W/mK thermal conductivity with outstanding heat transfer capabilities
High tack surface reduces contact resistance and improves thermal interface efficiency
27 Shore 00 hardness with high softness and compliance for complex parts
Stable operation from -40℃ to 160℃ with continuous use temperature up to 200℃
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 2.0 W/mK | ASTM D5470 |
| Hardness | 27 Shore 00 | ASTM 2240 |
| Specific Gravity | 2.50 g/cc | ASTM D297 |
| Tensile Strength | 48 psi | ASTM D412 |
| Dielectric Breakdown Voltage | >10000 VAC | ASTM D149 |
| Fire Rating | UL94 V0 | Equivalent UL |
| Volume Resistivity | 7.3×10¹² Ohm-meter | ASTM D257 |
Standard thicknesses range from 0.010" (0.25mm) to 0.200" (5.08mm) in 0.010" increments. Custom thicknesses available upon request.
- 8" x 16" (203mm x 406mm)
- 16" x 18" (406mm x 457mm)
- Pressure Sensitive Adhesive: One side (A1 suffix) or double side (A2 suffix)
- Fiberglass reinforcement available for sheet types
- Individual die-cut shapes can be supplied
- LED TV and LED-lit lamps
- RDRAM memory modules
- Micro heat pipe thermal solutions
- Automotive engine control units
- Telecommunication hardware
- Handheld portable electronics
Manufactured by Ziitek Thermal Conductive Materials & Technology Ltd., this product complies with UL94 V-0, SGS, and ROHS standards. Our commitment to "Do it right the First time, total quality control" ensures consistent performance and reliability.
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