Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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Naturally Tacky Needing No Further Adhesive Coating Thermal Conductive Silicone Pad For Heating Devices And Heat Sink

Price Negotiable
Price: negotiation
MOQ: 1000pcs
Delivery Time: 3-5work days
Brand: ZIITEK
Product Description

Naturally Tacky Needing No Further Adhesive Coating Thermal Conductive Silicone Pad For Heating Devices And Heat Sink

 

Products description

 

The TIF®140-10E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features:


> Good thermal conductive: 1.5 W/mK 
> Naturally tacky needing no further adhesive coating 
> Soft and Compressible for low stress applications

> Outstanding thermal performance
> Available in varies thickness

> RoHS compliant
> UL recognized


Applications:


> LED TV and LED-lit lamps
> RDRAM memory modules 
> Micro heat pipe thermal solutions 
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
 
Typical Properties of TIF®140-10E Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ASTM D374
Specific Gravity 2.3 g/cc ASTM D297
Hardness 35 Shore 00 ASTM 2240
Operating Temp -40 ~ 160℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant @1MHz 4.7 MHz ASTM D150
Volume Resistivity 2.0X1012 Ohm-cm ASTM D257
Fire rating 94 V0 UL E331100
Outgassing (TML) 0.35% ASTM E595
Thermal conductivity 1.5 W/m-K ASTM D5470
 
Product Specification

Products Thicknesses: 0.020"(0.5mm)~0.200"(5.0mm)
Product Sizes: 8" x 16"(203mm x 406mm) 
Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming.
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile
 

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.Ziitek provide thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products and so on, for various applications.

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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