TIS 112-01 Thermal Interface Pad - 0.3mm Thickness, 1.0 W/m·K Conductivity, UL 94 V-0 Rated
Price:
Negotiable
MOQ:
1000PCS
Delivery Time:
2-3Word days
Brand:
Ziitek
Product Description
TIS™ 112-01 Thermal Interface Material
The TIS™ 112-01 series represents high-efficiency insulation materials with exceptional thermal conduction properties. By incorporating an insulation base film made from silica gel into the heat-conduction matrix, these pads deliver outstanding performance in both electrical insulation and heat transfer applications.
Technical Datasheet
Key Features
Highly compliant surface characteristics with 1.0 W/m·K thermal conductivity
High dielectric strength with excellent thermal conductive properties
Low thermal resistance with high voltage isolation capability
Exceptional resistance to tears and punctures
Applications
Power conversion equipment and power semiconductors
MOSFETs & IGBT packages and automotive control units
Audio and video components and general high-pressure interfaces
Closed cell heat sinking applications
Technical Specifications
Thermal Conductivity
1.0 W/m·K
Dielectric Breakdown Voltage
>3500 V
Operating Temperature
-50°C to 180°C
Thickness Options
0.3mm, 0.23mm, 0.45mm
Fire Rating
UL 94 V-0
Hardness
50 Shore A
Available Thicknesses
0.127mm (0.005"), 0.152mm (0.006"), 0.203mm (0.008"), 0.228mm (0.009"), 0.254mm (0.010"), 0.304mm (0.012"), 0.457mm (0.018")
Standard Sheet Sizes
406mm x 457mm (16" x 18"), 406mm x 60.9M (16" x 200')
Customization Options
Individual die-cut shapes available upon request. Pressure-sensitive adhesive options: single-side (A1 suffix) or double-side (A2 suffix). All TIS™ series sheets include fiberglass reinforcement for enhanced durability.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronic Materials & Technology Ltd.
Location
No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai