Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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3.0W Silicon Thermal Gap Filler Pad For PC DVR Digital Video Recorder Set Top Box Applied

Price Negotiable
Price: negotiation
MOQ: 1000pcs
Delivery Time: 3-5work days
Brand: ZIITEK
Product Description

3.0W Silicon Thermal Gap Filler Pad For PC DVR Digital Video Recorder Set Top Box Applied

 

The TIF100-30-25E is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


Features:

 

>  Good thermal conductive: 3.0W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness

>  RoHS compliant
>  UL recognized
>  Easy release construction


Applications:

 

>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE

Typical Properties of TIF100-30-25E Series
Property Value Test method
Color Pink ***
Construction &Compostion Ceramic filled silicone elastomer ***
Specific Gravity 3.0 g/cc ASTM D297
Thickness range 0.02"(0.5mm)~0.200"(5.0mm) ASTM C351
Hardness 35 Shore 00 ASTM 2240
Outgassing(TML) 0.40% ASTM D412
Continuos Use Temp -45 to 200℃ ***
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity 1.0X10¹² Ohm-meter ASTM D257
Flame rating 94 V0 equivalent UL
Thermal conductivity 3.0 W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.


Standard Sheets Sizes:    
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:                  
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:       
TIF™ series sheets type can add with fiberglass reinforced.
 

Company profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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