Fiberglass Reinforced Thermal Gap Filler Pad 0.5mm 1.5W/mK 55 Shore00 for Tablet PC
The TIF® 140FG-05S is engineered for efficient gap heat transfer, filling gaps and completing heat transfer between heating and cooling components. It also provides insulation, damping, and sealing functions to meet equipment miniaturization and ultra-thin design requirements. This highly technological and versatile thermal conductivity filler material offers a wide range of thickness applications.
- Good thermal conductivity: 1.5 W/mK
- Naturally tacky - no additional adhesive coating required
- Soft and compressible for low stress applications
- Available in various thicknesses
- RoHS compliant
- UL recognized
- Easy release construction
- Cooling components to chassis or frame
- High speed mass storage drives
- Heat sinking housing at LED-lit BLU in LCD
- LED TV and LED-lit lamps
- RDRAM memory modules
- CPU cooling
- Display card thermal management
- Mainboard/motherboard applications
- Notebook computers
- Power supply units
- Heat pipe thermal solutions
- Memory modules
- Mass storage devices
| Property | Value | Test Method |
|---|---|---|
| Color | Blue | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | - |
| Density (g/cm³) | 2.0 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.020 / 0.25~0.50 0.030~0.200 / 0.75~5.00 |
ASTM D374 |
| Hardness | 65 Shore 00 45 Shore 00 |
ASTM 2240 |
| Continuous Use Temperature | -40 to 200℃ | - |
| Breakdown Voltage (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity | ＞1.0×10¹² Ohm-meter | ASTM D257 |
| Thermal Conductivity (W/m-K) | 1.5 | ASTM D5470 ISO22007 |
| Fire Rating | V-0 | UL 94 (E331100) |
- Standard Thickness: 0.010" (0.25 mm) – 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
- Standard Size: 16"×16" (406 mm × 406 mm)
- Reinforcement Fabric: FG (Fiberglass)
- Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
- Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
- PET film or foam protection
- Paper card separation between layers
- Export carton packaging (inside and outside)
- Customized packaging available to meet customer requirements
Lead Time: Quantity: 5000 pieces | Estimated Time: To be negotiated
Ziitek is a high-tech enterprise dedicated to the R&D, manufacture, and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines.
All products are compliant with UL94 V-0, SGS and ROHS standards.
ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
With professional R&D capabilities and over 19 years of experience in the thermal interface material industry, Ziitek owns many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.