Thermal Conductive Silicone Pad 1.5W/mK Gap Filler for GPU CPU Notebook Heat Transfer
The TIF®180-05S is a silicone-based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, is conformable, and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.
- Good thermal conductivity: 1.5 W/mK
- Naturally tacky needing no further adhesive coating
- Soft and compressible for low stress applications
- Available in various thicknesses
- RoHS compliant and UL recognized
- CPU
- Display card
- Mainboard/mother board
- Notebook
- Power supply
- Heat pipe thermal solutions
- Memory Modules
- Mass storage devices
- Automotive electronics
- Set top boxes
- Audio and video components
- IT infrastructure
| Property | Value | Test Method |
|---|---|---|
| Color | Blue | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | - |
| Density (g/cm³) | 2.0 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.020 (0.25~0.50) 0.030~0.200 (0.75~5.00) |
ASTM D374 |
| Hardness | 65 Shore 00 45 Shore 00 |
ASTM 2240 |
| Continuous Use Temp | -40 to 200℃ | - |
| Breakdown Voltage (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity | ＞1.0×10¹² Ohm-meter | ASTM D257 |
| Thermal Conductivity (W/m-K) | 1.5 | ASTM D5470 ISO22007 |
| Fire rating | V-0 | UL 94 (E331100) |
Standard Thickness: 0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm × 406 mm)
- Reinforcement Fabric: FG (Fiberglass)
- Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
- Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging of thermal pad:
- With PET film or foam for protection
- Use paper card to separate each layer
- Export carton inside and outside
- Meet with customers' requirement - customized
Lead Time:
Quantity (Pieces): 5000
Estimated Time (days): To be negotiated
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solutions and manufacturing superior thermal interface materials for the competitive market. Our vast experience allows us to best assist our customers in the thermal engineering field. We serve customers with customized products, full product lines, and flexible production, which makes us the best and reliable partner for you. Let's make your design more perfect!
Do it right the first time, total quality control
Work precisely and thoroughly for effectiveness
Quick response, on time delivery and excellent service
Complete teamwork, including sales team, marketing team, engineering team, R&D team, manufacturing team, logistics team. All is for supporting and servicing a satisfying service for customers.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.