Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
Verified Supplier
20 Years
Since 2006
Menu

Low Compression Thermally Conductive Putty Thermal Gel 3.5W/mK with 0.1mm Bond Line for Vehicle Controller Cooling

Price Negotiable
Price: negotiation
MOQ: 1000pcs
Delivery Time: 3-5work days
Brand: ZIITEK
Product Description
Low Compression Thermally Conductive Putty Thermal Gel 3.5W/mK

TIF®035-05 is a soft silicone gel-based gap filler pad engineered with a specialized filler blend to deliver exceptional thermal conductivity and superior softness. This thermally conductive putty features higher viscosity than conventional thermal greases, preventing filler separation from the silicone matrix and reducing filler migration for consistent thermal performance.

Key Features
  • Thermal conductivity: 3.5 W/mK
  • Soft composition with very low compression
  • Low thermal impedance: 0.08°C·in²/W @10psi
  • Automated application compatibility
  • Proven long-term reliability
  • Operating temperature range: -45°C to 200°C
  • Flame rating: UL 94 V-0
Applications
  • Heat-sink & frame assemblies
  • LED backlight modules and LED lighting systems
  • High-speed hardware drivers
  • Micro heat pipe integration
  • Vehicle engine controller cooling
  • Telecommunications equipment
  • Semiconductor automatic laboratory equipment
Technical Specifications
Property Value Test Method
Color Blue Visual
Construction & Composition Ceramic filled silicon material -
Flow Rate 30 g/min Ziitek Test Method (30 cc syringe/2.5 mm orifice/90 psi)
Density 3.25 g/cc ASTM D297
Thermal Conductivity 3.5 W/mK ASTM D5470
Thermal Impedance @10psi 0.08°C·in²/W ASTM D5470
Thermal Impedance @50psi 0.075°C·in²/W ASTM D5470
Recommended Operating Temperature -45°C to 200°C Ziitek Test Method
Dielectric Strength ≥4000 V/mm ASTM D149
Bond Line Thickness 0.1 mm Ziitek Test Method
Flame Rating V-0 UL 94
Shelf Life 12 months -
Packaging Options
  • 30 cc per piece, 98 pieces per box
  • 300 cc per piece, 6 pieces per box
  • Custom packaging available for automated applications
TIF®035-05 Thermally Conductive Putty Thermal Gel product packaging and application
Manufacturer Profile

Ziitek Electronic Material and Technology Ltd. specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. With extensive experience in thermal engineering, we provide customized products, comprehensive product lines, and flexible production capabilities to support your thermal management requirements.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

Request A Quote

Please check your email address.
Your message must be at least 20 characters.