Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
Verified Supplier
20 Years
Since 2006
Menu
Chemicals Coating&Paint

TIF®050-11 Silicone Thermal Gap Filler 5.0 W/mK -45°C to 200°C UL 94 V-0 for Electronics Cooling

Price Negotiable
Price: negotiation
MOQ: 1000tube
Delivery Time: 7-15work days
Brand: ZIITEK
Product Description
TIF®050-11 Silicone Thermal Gap Filler
TIF®050-11 is a soft silicone gel-based gap filler pad engineered with a specialized filler blend to deliver exceptional thermal conductivity and superior softness. This thermal putty features high viscosity that prevents filler separation and migration, ensuring consistent thermal performance over time.
Key Specifications
Thermal Conductivity: 5.0 W/mK | Operating Temperature: -45°C to 200°C | Density: 3.20 g/cc | Flame Rating: UL 94 V-0
Product Features
  • High thermal conductivity of 5.0 W/mK
  • Very low compression force requirements
  • Minimal thermal impedance
  • Suitable for automated dispensing equipment
  • Proven long-term reliability and performance stability
Primary Applications
  • Heat-sink and frame thermal interface
  • LED backlight modules and LED lighting systems
  • High-speed hardware drivers and controllers
  • Micro heat pipe assemblies
  • Vehicle engine controllers
  • Telecommunications equipment
  • Semiconductor automated laboratory equipment
Technical Specifications
Property Value Test Method
Color Gray Visual
Flow Rate 40 g/min Ziitek Test Method
Density 3.20 g/cc ASTM D297
Thermal Conductivity 5.0 W/mK ASTM D5470
Thermal Impedance @10psi 0.077 ℃.in²/w ASTM D5470
Thermal Impedance @50psi 0.068 ℃.in²/w ASTM D5470
Operating Temperature -45°C to 200°C Ziitek Test Method
Dielectric Strength ≥4000 V/mm ASTM D149
Bond Line Thickness 0.2 mm Ziitek Test Method
Flame Rating V-0 UL 94
Shelf Life 12 months -
Packaging Options
Standard packaging includes 30 cc per piece (98 pieces per box) or 300 cc per piece (6 pieces per box). Custom packaging solutions are available for automated production processes. Contact our technical team to discuss your specific requirements.
TIF®050-11 Silicone Thermal Gap Filler product image showing gray thermal putty material
Manufacturer Profile
Dongguan Ziitek Electronic Material Technology Co., Ltd., established in 2006, is a high-tech enterprise specializing in research, development, production, and sales of thermal interface materials. Our product portfolio includes thermal gap fillers, low melting point thermal interface materials, thermal insulators, adhesive tapes, interface pads, thermal greases, thermal plastics, silicone rubber, and silicone rubber foam.
Customer Support Services
  • 12-hour online service with rapid inquiry response
  • Operating hours: 8:00 AM - 5:30 PM, Monday to Saturday (UTC+8)
  • English-speaking technical support team
  • Standard export packaging or custom labeling available
  • Free samples provided for evaluation
  • Comprehensive after-sales support and quality assurance
Additional product image of TIF®050-11 thermal gap filler showing application and packaging

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

Request A Quote

Please check your email address.
Your message must be at least 20 characters.