New products die cutting in round shape thermal adhesive double side tape fire resistance equate 94 V-0​

The TIA™605P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.

Features

Thermal Conductivity: 0.8 W/mK
High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
High performance, thermally conductive acrylic adhesive
Fire rating equate 94 V0

Applications

Mount heat sink onto BGA graphic processor or drive processor
Mount heat spreader onto power converter PCB or onto motor control PCB
High performance, thermally conductive acrylic adhesive
Can be used instead of heat cure adhesive,screw mounting or clip mounting

Standard Thicknesses:

0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)

Consult the factory alternate thickness.

Standard Sizes:

40" x 100'(1016mm x 30.48M) Individual die cut shapes can be supplied.

Reinforcement:

TIA™600P series The coil can be filled with PET.