Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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TIS580-10 Thermally Conductive Silicone Adhesive 1.0W/mK for LED Lamps and Power Module Potting

Price Negotiable
Price: Negotiable
MOQ: 25PC
Delivery Time: 2-3 work days
Brand: ziitek
Product Description
TIS™580-10 Thermally Conductive Silicone Adhesive

TIS™580-10 Series is a dealcoholized, one-component, room temperature cure thermally conductive silicone adhesive designed for LED lamps and power-driven potting applications. This advanced formulation provides excellent heat conduction and adhesion to electronic components, curing into a high-hardness elastomer that firmly attaches to substrates for minimal thermal impedance.

Key Features
  • High thermal conductivity: 1.0W/mK
  • Excellent electrical insulation properties
  • Ready-to-use formulation with low viscosity
  • Strong adhesion to copper, aluminum, and stainless steel
  • Non-corrosive dealcoholized system
  • Good solvent and water resistance
  • Long working life with low shrinkage
  • Excellent thermal shock resistance
  • UL94 V-0 flame retardant rating
Technical Documentation

Product Applications

Ideal replacement for thermal paste and pads in gap-filling applications between LED aluminum motherboards and heat sinks, high-power electrical modules and heat sinks. Replaces traditional mechanical fastening methods with more reliable thermal conduction, simplified handling, and cost-effective solutions. Applications include:

  • Portable computers and microprocessors
  • High-power LED systems
  • Internal storage modules and cache systems
  • DC/AC translators and IGBT power modules
  • Semiconductor encapsulation
  • Relay switches, rectifiers, and transformers
Technical Specifications
Property Value Test Method
Appearance White paste Visual
Density (g/cm³, 25℃) 1.3 ASTM D297
Tack-free time (min, 25℃) ≤20 Internal Method
Cure type Dealcoholized Internal Method
Viscosity @25℃ Brookfield (Uncured) 30K cps ASTM D1084
Total cure time (days, 25℃) 3-7 Internal Method
Elongation (%) ≥200 ASTM D412
Hardness (Shore A) 45 ASTM D2240
Lap Shear Strength (MPa) ≥2.5 ASTM D1876
Peel Strength (N/mm) >5 ASTM D1876
Operation temperature (℃) -60~250 Internal Method
Volume Resistivity (Ω*cm) 2.0×10¹⁶ ASTM D257
Dielectric Strength (KV/mm) 21 ASTM D149
Dielectric Constant (1.2MHz) 2.9 ASTM D150
Thermal Conductivity W/(m*K) 1.0 ASTM D5470
Flame Retardancy UL94 V-0 E331100
Packaging Options
  • 100ml tubes: 100 pieces per box
  • 300ml cartridges: 24 pieces per box
Storage & Handling
  • Store in cool, dry place at 25℃
  • Shelf life: 6 months
  • Non-hazardous material - follow local chemical transportation regulations
Manufacturer Information

Ziitek Company brings over 18 years of professional R&D experience in thermal interface materials, offering unique formulations and core technologies. Our commitment is to provide quality, competitive products for long-term business partnerships worldwide.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

TIS580-10 Thermally Conductive Silicone Adhesive product packaging and application examples Ziitek thermal interface materials manufacturing facility and quality control processes Ziitek company certifications including ISO and UL standards

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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