TIF460 2.0W/mK Thermal Gap Filler Pad 1.5mm for Motherboard Heat Sinking
TIF®400 Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides excellent surface conformity and ease of use, effectively transferring heat while providing basic physical protection for electronic components.
- Good thermal conductivity: 2.0 W/mK
- Naturally tacky - no additional adhesive coating required
- Soft and compressible for low stress applications
- Available in various thicknesses
- Cooling components to chassis or frame
- High speed mass storage drives
- Heat sinking housing at LED-lit BLU in LCD
- LED TV and LED-lit lamps
- RDRAM memory modules
- Micro heat pipe thermal solutions
- Automotive engine control units
- Telecommunication hardware
- Handheld portable electronics
- Semiconductor automated test equipment (ATE)
| Property | Value | Test Method |
|---|---|---|
| Color | Yellow | Visual |
| Construction | Ceramic filled silicone elastomer | - |
| Thickness range (inch/mm) | 0.010"~0.020" (0.25~0.50mm) | 0.030"~0.200" (0.75~5.00mm) | ASTM D374 |
| Hardness (Shore 00) | 65 | 45 | ASTM 2240 |
| Density (g/cm³) | 2.5 | ASTM D792 |
| Recommended Operating Temperature | -40°C to 200°C | - |
| Breakdown Strength (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @1MHz | 5.0 | ASTM D150 |
| Volume Resistivity (Ohm-cm) | ＞1.0×10¹² | ASTM D257 |
| Thermal conductivity (W/m-K) | 2.0 | ASTM D5470 / ISO22007 |
| Flame Rating | V-0 | UL94 (E331100) |
Standard Thickness: 0.010" (0.25 mm) to 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16" × 16" (406 mm × 406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
- Our value message: "Do it right the First time, total quality control"
- Core competency in thermal conductive interface materials
- Competitive advantage products
- Confidentiality agreement and business secret contracts
- Free sample offers
- Quality assurance contracts
A thermal silicone pad is a pre-formed TIM typically made of a silicone-based material and thermally conductive fillers. It is designed to fill gaps between heat sources and heat sinks. Depending on the product formulation, thermal silicone pads can also provide electrical insulation.
Key advantages include easy installation, controlled thickness, good flexibility, and effective gap-filling capability. Depending on the application, thermal silicone pads can also be designed with different levels of thermal conductivity, hardness, flame resistance, and electrical insulation.
Not necessarily. If the pad is too thin to adequately fill the actual gap, proper interface contact may not be achieved. The appropriate thickness should be selected based on the actual structural tolerances and application requirements.
Different product series can be available in thicknesses ranging from very thin pads to several millimeters or even thicker options. The appropriate thickness should be determined based on the customer's gap, compression requirements, and assembly structure.
Yes. Thermal silicone pads can be customized according to the customer's product structure, including length, width, thickness, and complex shapes. Die-cutting, punching, and other processing methods can also be used to produce customized parts.
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