Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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Glassfiber Reinforced Thermal Conductivity Pad Thermal Gap Filler For LED Lights Silicone Elastomer

Price Negotiable
Price: negotiation
MOQ: 1000pcs
Delivery Time: 3-5 work days
Brand: ZIITEK
Product Description

Glassfiber Reinforced Thermal Conductivity Pad Thermal Gap Filler For LED Lights Silicone Elastomer

 

The TIF™340 thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 

Features:

 

> Thickness: 3.0W/mK 
> Naturally tacky needing no further adhesive coating 
> Soft and Compressible for low stress applications
> Available in varies thickness

> Easy release construction
> Electrically isolating
> High durability

 


Applications:


> Cooling components to the chassis of frame  
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules 
> CPU
> display card
> mainboard/mother board
> notebook
> power supply
> Heat pipe thermal solutions
> Memory Modules

Typical Properties of TIF300 Series
Color Gray Visual
Construction &Compostion Ceramic filled silicone ******
Thickness 0.020"(0.5mm)~0.200"(5.0MM) ASTM D374
Specific Gravity 3.05g/cc ASTM D792
Hardness 27±5 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity ≥1.0X10¹² Ohm-meter ASTM D257
Fire rating 94 V0 UL E331100
Thermal conductivity 3.0 W/m-K ASTM D5470

 

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.


Standard Sheets Sizes:         
8" x 16"(203mm x 406mm)
Individual die cut shapes and custom thickness can be supplied.

Please contact us of confirming.


Peressure Sensitive Adhesive:                     
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.


Reinforcement:                     
TIF™ series sheets type can add with fiberglass reinforced.

 

 
Company profile
 
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Independent R&D team

 

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Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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