Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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TIF150-30-12U Soft Thermal Gap Filler 3.0 W/mK for LED Lighting and Electronics - Multiple Thickness Options 0.25mm to 5.08mm

Price Negotiable
Price: negotiation
MOQ: 1000pcs
Delivery Time: 3-5work days
Brand: ZIITEK
Product Description
TIF150-30-12U Soft Thermal Gap Filler
Advanced thermal interface material with 3.0 W/mK conductivity for efficient heat transfer in LED lighting and electronic applications.
Key Features
  • High thermal conductivity: 3.0 W/mK
  • Naturally tacky surface eliminates need for additional adhesives
  • Soft and compressible design for low-stress applications
  • Available in multiple thickness options from 0.25mm to 5.08mm
  • UL94 V-0 flame rating compliant
Technical Specifications
Property Value Test Method
Thermal Conductivity 3.0 W/mK ASTM D5470
Hardness 27 Shore 00 ASTM 2240
Continuous Use Temperature -50°C to 200°C -
Dielectric Breakdown Voltage >10,000 VAC ASTM D149
Fire Rating 94 V0 UL Equivalent
Available Thickness Options
Standard Range
0.010" (0.25mm) to 0.200" (5.08mm)
Sheet Sizes
8" x 16" (203mm x 406mm)
16" x 18" (406mm x 457mm)
Applications
LED TV backlighting, automotive engine control units, telecommunications hardware, portable electronics, semiconductor test equipment, and memory module cooling.
Customization Options
Available with pressure-sensitive adhesive (single or double-sided) and fiberglass reinforcement upon request.
Quality Assurance
Compliant with UL94 V-0, SGS, and ROHS standards. Free samples available for qualified applications.
TIF150-30-12U Thermal Gap Filler product diagram showing material structure and applications

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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