Dongguan Ziitek Electronical Material and Technology Co., Ltd
                                                                                                           
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TIF150-30-12U Soft Thermal Gap Filler 3.0 W/mK for LED Lighting and Electronics - Multiple Thickness Options 0.25mm to 5.08mm

Price Negotiable
Price: negotiation
MOQ: 1000pcs
Delivery Time: 3-5work days
Brand: ZIITEK
Product Description
TIF150-30-12U Soft Thermal Gap Filler
Advanced thermal interface material with 3.0 W/mK conductivity for efficient heat transfer in LED lighting and electronic applications.
Key Features
  • High thermal conductivity: 3.0 W/mK
  • Naturally tacky surface eliminates need for additional adhesives
  • Soft and compressible design for low-stress applications
  • Available in multiple thickness options from 0.25mm to 5.08mm
  • UL94 V-0 flame rating compliant
Technical Specifications
Property Value Test Method
Thermal Conductivity 3.0 W/mK ASTM D5470
Hardness 27 Shore 00 ASTM 2240
Continuous Use Temperature -50°C to 200°C -
Dielectric Breakdown Voltage >10,000 VAC ASTM D149
Fire Rating 94 V0 UL Equivalent
Available Thickness Options
Standard Range
0.010" (0.25mm) to 0.200" (5.08mm)
Sheet Sizes
8" x 16" (203mm x 406mm)
16" x 18" (406mm x 457mm)
Applications
LED TV backlighting, automotive engine control units, telecommunications hardware, portable electronics, semiconductor test equipment, and memory module cooling.
Customization Options
Available with pressure-sensitive adhesive (single or double-sided) and fiberglass reinforcement upon request.
Quality Assurance
Compliant with UL94 V-0, SGS, and ROHS standards. Free samples available for qualified applications.
TIF150-30-12U Thermal Gap Filler product diagram showing material structure and applications

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Co., Ltd
Location No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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